ZHCSJI4F July   2006  – March 2015 TS3A4751

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 1.8-V Supply
    6. 6.6 Electrical Characteristics for 3-V Supply
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Logic Inputs
      2. 8.1.2 Analog Signal Levels
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TS3A4751 UNIT
PW RGY RUC
14 PINS
RθJA Junction-to-ambient thermal resistance 132.3 68.5 196.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60.6 83.1 73.9
RθJB Junction-to-board thermal resistance 74.2 44.6 130.7
ψJT Junction-to-top characterization parameter 11.2 7.8 2.1
ψJB Junction-to-board characterization parameter 73.6 44.7 130.6
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 24.6 N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.