ZHCSR75 November   2022 TPSM82902

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Mode Selection and Device Configuration (MODE/S-CONF)
      2. 7.3.2 Adjustable VO Operation (External Voltage Divider)
      3. 7.3.3 Setable VO Operation (VSET and Internal Voltage Divider)
      4. 7.3.4 Soft Start/Tracking (SS/TR)
      5. 7.3.5 Smart Enable with Precise Threshold
      6. 7.3.6 Power Good (PG)
      7. 7.3.7 Undervoltage Lockout (UVLO)
      8. 7.3.8 Current Limit And Short Circuit Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Width Modulation (PWM) Operation
      2. 7.4.2 AEE (Automatic Efficiency Enhancement)
      3. 7.4.3 Power Save Mode Operation (Auto PFM/PWM)
      4. 7.4.4 100% Duty-Cycle Operation
      5. 7.4.5 Output Discharge Function
      6. 7.4.6 Starting into a Pre-Biased Load
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application with Adjustable Output Voltage
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Programming the Output Voltage
        3. 8.2.2.3 Capacitor Selection
          1. 8.2.2.3.1 Output Capacitor
          2. 8.2.2.3.2 Input Capacitor
          3. 8.2.2.3.3 Soft-Start Capacitor
        4. 8.2.2.4 Tracking Function
      3. 8.2.3 Application Curves
    3. 8.3 Typical Application with Setable VO Using VSET
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
        1. 8.5.2.1 Thermal Considerations
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方产品免责声明
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

5 Pin Configuration and Functions


GUID-20210326-CA0I-ZB0J-NCKJ-1BB583BMSRXF-low.gif
Figure 5-1 11-Pin SIS MicroSiP™ Package (Top View, Device Pins Face Down)
Table 5-1 Pin Functions
PinI/ODescription
NameNumber
VIN1, 2IPower supply input pin. Ensure the input capacitor is connected as close as possible between the VIN and GND pins.
EN3IEnable input pin. Connect to logic low to disable the device. Pull high to enable the device. Do not leave this pin unconnected.
MODE/
S-CONF		4IDevice mode selection (auto PFM/PWM or forced PWM operation) and SmartConfig™ application. Connect high, low, or to a resistor to configure the device according to Table 7-2. Do not leave this pin unconnected.
SS/TR5ISoft start/tracking pin. An external capacitor connected from this pin to GND defines the rise time for the internal reference voltage. The pin can also be used as an input for tracking and sequencing. The pin can be left floating for the fastest ramp-up time.
PG6OOpen-drain power-good output. High = VOUT is ready. Low = VOUT is below nominal regulation. This pin requires a pullup resistor.
FB/VSET7IDepends on device configuration (see Section 7.3.1)
  • FB: Voltage feedback input. Connect a resistive output voltage divider to this pin.
  • VSET: Output voltage setting pin. Connect a resistor to GND to choose the output voltage according to Table 7-3.
SW/NC8NCSwitch pin of the converter. Do not connect, leave floating.
VOUT9, 10OOutput voltage pin. Connect directly to the positive pin of the output capacitor.
GND11—Ground pin. It must be connected directly to the common ground plane. It must be soldered to achieve appropriate power dissipation and mechanical reliability.