ZHCSKO1B December   2019  – September 2021 TPSM53603

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (VIN = 5 V)
    7. 6.7 Typical Characteristics (VIN = 12 V)
    8. 6.8 Typical Characteristics (VIN = 24 V)
    9. 6.9 Typical Characteristics (VIN = 36 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Switching Frequency
      3. 7.3.3  Input Capacitors
      4. 7.3.4  Output Capacitors
      5. 7.3.5  Output On/Off Enable (EN)
      6. 7.3.6  Programmable Undervoltage Lockout (UVLO)
      7. 7.3.7  Power Good (PGOOD)
      8. 7.3.8  Light Load Operation
      9. 7.3.9  Voltage Dropout
      10. 7.3.10 Overcurrent Protection (OCP)
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Auto Mode
      3. 7.4.3 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Input Capacitors
        4. 8.2.2.4 Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Theta JA versus PCB Area
    4. 10.4 Package Specifications
    5. 10.5 EMI
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.3 Theta JA versus PCB Area

The amount of PCB copper affects the thermal performance of the device. Figure 10-4 shows the effects of copper area on the junction-to-ambient thermal resistance (RθJA) of the TPSM53603. The junction-to-ambient thermal resistance is plotted for a 4-layer PCB with PCB area from 30 cm2 to 80 cm2.

To determine the required copper area for an application:

  1. Determine the maximum power dissipation of the device in the application by referencing the power dissipation graphs in Section 6.6 through Section 6.9.
  2. Calculate the maximum RθJA using Equation 3 and the maximum ambient temperature of the application.
    Equation 3. GUID-4C935AA8-0BAB-407E-B30A-FF31ECE25023-low.gif
  3. Reference Figure 10-4 to determine the minimum required PCB area for the application conditions.

GUID-CA1A43B9-971B-463C-BFC3-818E8340583B-low.gifFigure 10-4 RθJA versus PCB Area (per Layer)