ZHCSH45B June   2017  – October 2021 TPS7A83A

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: General
    6. 7.6 Electrical Characteristics: TPS7A8300A
    7. 7.7 Electrical Characteristics: TPS7A8301A
    8. 7.8 Typical Characteristics: TPS7A8300A
    9. 7.9 Typical Characteristics: TPS7A8301A
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Voltage Regulation Features
        1. 8.3.1.1 DC Regulation
        2. 8.3.1.2 AC and Transient Response
      2. 8.3.2 System Start-Up Features
        1. 8.3.2.1 Programmable Soft-Start (NR/SS)
        2. 8.3.2.2 Internal Sequencing
          1. 8.3.2.2.1 Enable (EN)
          2. 8.3.2.2.2 Undervoltage Lockout (UVLO) Control
          3. 8.3.2.2.3 Active Discharge
        3. 8.3.2.3 Power-Good Output (PG)
      3. 8.3.3 Internal Protection Features
        1. 8.3.3.1 Foldback Current Limit (ICL)
        2. 8.3.3.2 Thermal Protection (Tsd)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Regulation
      2. 8.4.2 Disabled
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 External Component Selection
        1. 9.1.1.1 Adjustable Operation
        2. 9.1.1.2 ANY-OUT Programmable Output Voltage
        3. 9.1.1.3 ANY-OUT Operation
        4. 9.1.1.4 Increasing ANY-OUT Resolution for LILO Conditions
        5. 9.1.1.5 Recommended Capacitor Types
        6. 9.1.1.6 Input and Output Capacitor Requirements (CIN and COUT)
        7. 9.1.1.7 Feed-Forward Capacitor (CFF)
        8. 9.1.1.8 Noise-Reduction and Soft-Start Capacitor (CNR/SS)
      2. 9.1.2 Start Up
        1. 9.1.2.1 Soft-Start (NR/SS)
          1. 9.1.2.1.1 Inrush Current
        2. 9.1.2.2 Undervoltage Lockout (UVLO)
        3. 9.1.2.3 Power-Good (PG) Function
      3. 9.1.3 AC and Transient Performance
        1. 9.1.3.1 Power-Supply Rejection Ratio (PSRR)
        2. 9.1.3.2 Output Voltage Noise
        3. 9.1.3.3 Optimizing Noise and PSRR
          1. 9.1.3.3.1 Charge Pump Noise
        4. 9.1.3.4 Load Transient Response
      4. 9.1.4 DC Performance
        1. 9.1.4.1 Output Voltage Accuracy (VOUT)
        2. 9.1.4.2 Dropout Voltage (VDO)
          1. 9.1.4.2.1 Behavior When Transitioning From Dropout Into Regulation
      5. 9.1.5 Sequencing Requirements
      6. 9.1.6 Negatively Biased Output
      7. 9.1.7 Reverse Current
      8. 9.1.8 Power Dissipation (PD)
        1. 9.1.8.1 Estimating Junction Temperature
        2. 9.1.8.2 Recommended Area for Continuous Operation (RACO)
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Evaluation Models
        2. 12.1.1.2 Spice Models
      2. 12.1.2 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.1.8.1 Estimating Junction Temperature

The JEDEC standard now recommends the use of psi (Ψ) thermal metrics to estimate the junction temperatures of the LDO when in-circuit on a typical PCB board application. These metrics are not strictly speaking thermal resistances, but rather offer practical and relative means of estimating junction temperatures. These psi metrics are determined to be significantly independent of the copper-spreading area. The key thermal metrics (ΨJT and ΨJB) are used in accordance with Equation 14.

Equation 14. GUID-6E2A00E5-4551-4207-8212-39E89361D157-low.gif

where:

  • PD is the power dissipated as explained in Equation 11
  • TT is the temperature at the center-top of the device package, and
  • TB is the PCB surface temperature measured 1 mm from the device package and centered on the package edge