ZHCSK49E
August 2019 – September 2022
TPS7A24
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagrams
7.3
Feature Description
7.3.1
Output Enable
7.3.2
Dropout Voltage
7.3.3
Current Limit
7.3.4
Undervoltage Lockout (UVLO)
7.3.5
Thermal Shutdown
7.3.6
Active Overshoot Pulldown Circuitry
7.4
Device Functional Modes
7.4.1
Device Functional Mode Comparison
7.4.2
Normal Operation
7.4.3
Dropout Operation
7.4.4
Disabled
8
Application and Implementation
8.1
Application Information
8.1.1
Adjustable Device Feedback Resistors
8.1.2
Recommended Capacitor Types
8.1.3
Input and Output Capacitor Requirements
8.1.4
Reverse Current
8.1.5
Feed-Forward Capacitor (CFF)
8.1.6
Power Dissipation (PD)
8.1.7
Estimating Junction Temperature
8.1.8
Special Consideration for Line Transients
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Transient Response
8.2.2.2
Selecting Feedback Divider Resistors
8.2.2.3
Thermal Dissipation
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Examples
9
Device and Documentation Support
9.1
Device Support
9.1.1
Device Nomenclature
9.2
接收文档更新通知
9.3
支持资源
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
术语表
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DBV|5
MPDS018S
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsk49e_oa
zhcsk49e_pm
6.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101
(2)
±1000
(1)
JEDEC document JEP155 states that 2-kV HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process.