ZHCSN51J june   2007  – april 2023 TPS74901

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Other Orderable Devices (non-M3 Suffix)
    6. 6.6  Electrical Characteristics: Orderable Device (M3 Suffix)
    7. 6.7  Typical Characteristics: IOUT = 50 mA (All Other Orderable Devices, Non-M3 Suffix)
    8. 6.8  Typical Characteristics: IOUT = 1 A (All Other Orderable Devices, Non-M3 Suffix)
    9. 6.9  Typical Characteristics: IOUT = 50 mA (M3 Suffix)
    10. 6.10 Typical Characteristics: IOUT = 1 A (M3 Suffix)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Shutdown
      2. 7.3.2 Power-Good
      3. 7.3.3 Internal Current Limit
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input, Output, and BIAS Capacitor Requirements
      2. 8.1.2 Transient Response
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Output Noise
      5. 8.1.5 Programmable Soft-Start
      6. 8.1.6 Sequencing Requirements
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
        2. 8.4.1.2 Thermal Considerations
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Evaluation Modules
        2. 9.1.1.2 Spice Models
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision I (May 2016) to Revision J (April 2023)

  • 更新了整个文档中的表格、图和交叉参考的编号格式 Go
  • 向文档添加了 M3 后缀器件Go
  • 添加了指向应用 部分的链接Go
  • Added M3 suffix Typical Characteristics sectionsGo

Changes from Revision H (November 2015) to Revision I (May 2016)

  • 向文档中添加了 DRC 封装Go
  • 更改了封装 特性要点Go
  • 向说明 部分添加了 DRC 封装Go
  • 向器件信息 表中添加了 DRC (VSON) 封装Go
  • Added DRC package to Pin Configuration and Functions sectionGo