ZHCSN51J june   2007  – april 2023 TPS74901

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Other Orderable Devices (non-M3 Suffix)
    6. 6.6  Electrical Characteristics: Orderable Device (M3 Suffix)
    7. 6.7  Typical Characteristics: IOUT = 50 mA (All Other Orderable Devices, Non-M3 Suffix)
    8. 6.8  Typical Characteristics: IOUT = 1 A (All Other Orderable Devices, Non-M3 Suffix)
    9. 6.9  Typical Characteristics: IOUT = 50 mA (M3 Suffix)
    10. 6.10 Typical Characteristics: IOUT = 1 A (M3 Suffix)
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Shutdown
      2. 7.3.2 Power-Good
      3. 7.3.3 Internal Current Limit
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input, Output, and BIAS Capacitor Requirements
      2. 8.1.2 Transient Response
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Output Noise
      5. 8.1.5 Programmable Soft-Start
      6. 8.1.6 Sequencing Requirements
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
        2. 8.4.1.2 Thermal Considerations
      2. 8.4.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Evaluation Modules
        2. 9.1.1.2 Spice Models
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

GUID-64540E0F-419E-46B5-B448-C15FB7AA6555-low.gifFigure 5-1 RGW Package,20-Pin VQFN(Top View)
GUID-D04B7955-F7F7-4D26-B460-3875F9B847AD-low.gifFigure 5-3 DRC Package,10-Pin VSON With Thermal Pad(Top View)
GUID-0BFA54A3-0098-4AA9-BDB4-EB636EA31161-low.gifFigure 5-2 KTW Package,7-Pin DDPAK/TO-263(Top View)
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NAME DDPAK/TO-263 VQFN VSON
BIAS 6 10 4 I Bias input voltage for error amplifier, reference, and internal control circuits.
EN 7 11 5 I Enable pin. Driving this pin high enables the regulator. Driving this pin low puts the regulator into shutdown mode. This pin must not be left floating.
FB 2 16 8 I This pin is the feedback connection to the center tap of an external resistor divider network that sets the output voltage. This pin must not be left floating.
GND 4 12 6 Ground
IN 5 5, 6, 7, 8 1, 2 I Unregulated input to the device.
NC 2, 3, 4, 13, 14, 17 No connection. This pin can be left floating or connected to GND to allow better thermal contact to the top-side plane.
OUT 3 1, 18, 19, 20 9, 10 O Regulated output voltage. A small capacitor (total typical capacitance
≥ 2.2 µF, ceramic) is needed from this pin to ground to assure stability.
PG 9 3 O Power-good (PG) is an open-drain, active-high output that indicates the status of VOUT. When VOUT exceeds the PG trip threshold, the PG pin goes into a high-impedance state. When VOUT is below this threshold the pin is driven to a low-impedance state. A pullup resistor from 10 kΩ to 1 MΩ must be connected from this pin to a supply up to 5.5 V. The supply can be higher than the input voltage. Alternatively, the PG pin can be left floating if output monitoring is not necessary.
SS 1 15 7 Soft-start pin. A capacitor connected on this pin to ground sets the start-up time. If this pin is left floating, the regulator output soft-start ramp time is typically 100 µs.
Thermal Pad Solder to the ground plane for increased thermal performance.