ZHCSK38B August   2019  – December 2019 TPS66020 , TPS66021

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     功能表
      1.      TPS6602x 方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Supply Load Capacitance
    5. 6.5  Thermal Information
    6. 6.6  PP5V Power Switch Characteristics
    7. 6.7  PPHV Power Switch Characteristics
    8. 6.8  Power Path Supervisory
    9. 6.9  VBUS LDO Characteristics
    10. 6.10 Thermal Shutdown Characteristics
    11. 6.11 Input-output (I/O) Characteristics
    12. 6.12 Power Consumption Characteristics
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 5-V Source (PP5V Power Path)
        1. 8.3.1.1 PP5V Current Limit
        2. 8.3.1.2 PP5V Reverse Current Protection (RCP)
      2. 8.3.2 20-V Sink (PPHV Power Path)
        1. 8.3.2.1 PPHV Soft Start
        2. 8.3.2.2 PPHV Reverse Current Protection (RCP)
      3. 8.3.3 Overtemperature Protection
      4. 8.3.4 VBUS Overvoltage Protection (OVP)
      5. 8.3.5 Power Management and Supervisory
        1. 8.3.5.1 Supply Connections
        2. 8.3.5.2 Power Up Sequences
          1. 8.3.5.2.1 Normal Power Up
          2. 8.3.5.2.2 Dead Battery Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 State Transitions
        1. 8.4.1.1 DISABLED State
        2. 8.4.1.2 SRC 1.5-A State
        3. 8.4.1.3 SRC 3-A State
        4. 8.4.1.4 SNK State
        5. 8.4.1.5 FRS (Fast Role Swap) State
      2. 8.4.2 SRC FAULT State
      3. 8.4.3 SNK FAULT State
      4. 8.4.4 Device Functional Mode Summary
      5. 8.4.5 Enabling the PP5V Source Path
      6. 8.4.6 Enabling the PPHV Sink Path
      7. 8.4.7 Fast Role Swap (FRS)
        1. 8.4.7.1 Overview
        2. 8.4.7.2 Fast Role Swap Use Cases
        3. 8.4.7.3 Fast Role Swap Sequence
      8. 8.4.8 Faults
        1. 8.4.8.1 Fault Types
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 External Current Reference Resistor (RIREF)
        2. 9.2.2.2 External VLDO Capacitor (CVLDO)
        3. 9.2.2.3 PP5V Power Path Capacitance
        4. 9.2.2.4 PPHV, VBUS Power Path Capacitance
        5. 9.2.2.5 VBUS TVS Protection (Optional)
        6. 9.2.2.6 VBUS Schottky Diode Protection (Optional)
        7. 9.2.2.7 VBUS Overvoltage Protection (Optional)
        8. 9.2.2.8 Dead Battery Support
        9. 9.2.2.9 Fast Role Swap (FRS) (Optional)
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关链接
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Thermal Information

THERMAL METRIC(1) TPS6602x UNIT
YBG (WCSP)
28 PINS
RθJA,EFF Effective Junction-to-ambient thermal resistance(2) 44.3 °C/W
RθJA Junction-to-ambient thermal resistance 62.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.4 °C/W
RθJB Junction-to-board thermal resistance 13.8 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 13.7 °C/W
ψJB,EFF Effective Junction-to-board characterization parameter(2) 14.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Models based on typical application layout.