ZHCSLJ2B
September 2020 – July 2021
TPS62868
,
TPS62869
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Options
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
I2C InterfaceTiming Characteristics
7.7
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Power Save Mode
8.3.2
Forced PWM Mode
8.3.3
100% Duty Cycle Mode Operation
8.3.4
Start-up
8.3.5
Switch Current Limit and HICCUP Short-Circuit Protection
8.3.6
Undervoltage Lockout (UVLO)
8.3.7
Thermal Warning and Shutdown
8.4
Device Functional Modes
8.4.1
Enable and Disable (EN)
8.4.2
Output Discharge
8.4.3
Start-Up Output Voltage and I2C Target Address Selection
8.4.3.1
TPS6286xxA Devices
8.4.3.2
TPS6286xxxC Devices
8.4.4
Select Output Voltage Registers (VID)
8.4.5
Power Good ( PG)
8.5
Programming
8.5.1
Serial Interface Description
8.5.2
Standard-, Fast-, and Fast-Mode Plus Protocol
8.5.3
HS-Mode Protocol
8.5.4
I2C Update Sequence
8.5.5
I2C Register Reset
8.6
Register Map
8.6.1
Target Address Byte
8.6.2
Register Address Byte
8.6.3
VOUT Register 1
8.6.4
VOUT Register 2
8.6.5
CONTROL Register
8.6.6
STATUS Register
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Setting The Output Voltage
9.2.2.2
Output Filter Design
9.2.2.3
Inductor Selection
9.2.2.4
Capacitor Selection
9.2.3
Application Curves
9.3
Typical Application – TPS6286x0A and TPS6286x0xC Devices
9.3.1
Design Requirements
9.3.2
Detailed Design Procedure
9.3.2.1
Setting the Output Voltage
9.3.2.2
Output Filter Design
9.3.2.3
Inductor Selection
9.3.2.4
Capacitor Selection
9.3.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
11.2.1
Thermal Considerations
12
Device and Documentation Support
12.1
Device Support
12.1.1
第三方产品免责声明
12.2
Documentation Support
12.2.1
Related Documentation
12.3
支持资源
12.4
接收文档更新通知
12.5
Trademarks
12.6
术语表
12.7
Electrostatic Discharge Caution
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RQY|9
MPQF584
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcslj2b_oa
zhcslj2b_pm
8.3
Feature Description