ZHCSLJ2B September   2020  – July 2021 TPS62868 , TPS62869

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C InterfaceTiming Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Save Mode
      2. 8.3.2 Forced PWM Mode
      3. 8.3.3 100% Duty Cycle Mode Operation
      4. 8.3.4 Start-up
      5. 8.3.5 Switch Current Limit and HICCUP Short-Circuit Protection
      6. 8.3.6 Undervoltage Lockout (UVLO)
      7. 8.3.7 Thermal Warning and Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable (EN)
      2. 8.4.2 Output Discharge
      3. 8.4.3 Start-Up Output Voltage and I2C Target Address Selection
        1. 8.4.3.1 TPS6286xxA Devices
        2. 8.4.3.2 TPS6286xxxC Devices
      4. 8.4.4 Select Output Voltage Registers (VID)
      5. 8.4.5 Power Good ( PG)
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 8.5.3 HS-Mode Protocol
      4. 8.5.4 I2C Update Sequence
      5. 8.5.5 I2C Register Reset
    6. 8.6 Register Map
      1. 8.6.1 Target Address Byte
      2. 8.6.2 Register Address Byte
      3. 8.6.3 VOUT Register 1
      4. 8.6.4 VOUT Register 2
      5. 8.6.5 CONTROL Register
      6. 8.6.6 STATUS Register
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting The Output Voltage
        2. 9.2.2.2 Output Filter Design
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application – TPS6286x0A and TPS6286x0xC Devices
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Setting the Output Voltage
        2. 9.3.2.2 Output Filter Design
        3. 9.3.2.3 Inductor Selection
        4. 9.3.2.4 Capacitor Selection
      3. 9.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 支持资源
    4. 12.4 接收文档更新通知
    5. 12.5 Trademarks
    6. 12.6 术语表
    7. 12.7 Electrostatic Discharge Caution
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

CONTROL Register

Table 8-8 CONTROL Register Description
REGISTER ADDRESS 0X03 WRITE ONLY
BITFIELDTYPEDEFAULTDESCRIPTION
7ResetR/W01 - Reset all registers to default.
6Enable FPWM Mode during Output Voltage ChangeR/W10 - Keep the current mode status during output voltage change
1 - Force the device in FPWM during output voltage change.
5Software Enable DeviceR/W10 - Disable the device. All registers values are still kept.
1 - Re-enable the device with a new start-up without the tDelay period.
4Enable FPWM ModeR/W00 - Set the device in power save mode at light loads.
1 - Set the device in forced PWM mode at light loads.
3Enable Output DischargeR/W10 - Disable output discharge.
1 - Enable output discharge.
2Enable HICCUPR/W10 - Disable HICCUP. Enable latching protection.
1 - Enable HICCUP, Disable latching protection.
0:1Voltage Ramp SpeedR/W1100 - 20mV/µs (0.25 µs/step)
01 - 10 mV/µs (0.5 µs/step)
10 - 5 mV/µs (1 µs/step)
11 - 1 mV/µs (5 µs/step, default)