ZHCSIQ0F August   2018  – August 2020 TPS2120 , TPS2121

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     7
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Settling Time and Output Soft Start Control (SS)
        1. 9.3.1.1 Slew Rate vs. CSS Capacitor
      2. 9.3.2 Active Current Limiting (ILM)
      3. 9.3.3 Short-Circuit Protection
      4. 9.3.4 Thermal Protection (TSD)
      5. 9.3.5 Overvoltage Protection (OVx)
      6. 9.3.6 Fast Reverse Current Blocking (RCB)
      7. 9.3.7 Output Voltage Dip and Fast Switchover Control (TPS2121 only)
      8. 9.3.8 Input Voltage Comparator (VCOMP)
    4. 9.4 TPS2120 Device Functional Modes
    5. 9.5 TPS2121 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Manual Switchover Schematic
      2. 10.2.2 Design Requirements
      3. 10.2.3 Detailed Design Description
      4. 10.2.4 Design Procedure
        1. 10.2.4.1 Selecting PR1 and CP2 Resistors
        2. 10.2.4.2 Selecting OVx Resistors
        3. 10.2.4.3 Selecting Soft-Start Capacitor and Current Limit Resistors
      5. 10.2.5 Application Curves
    3. 10.3 Automatic Switchover with Priority (XCOMP)
      1. 10.3.1 Application Schematic
      2. 10.3.2 Design Requirements
      3. 10.3.3 Detailed Design Description
      4. 10.3.4 Design Procedure
        1. 10.3.4.1 Selecting PR1 and CP2 Resistors
      5. 10.3.5 Application Curves
    4. 10.4 Automatic Seamless Switchover with Priority (XREF)
      1. 10.4.1 Application Schematic
      2. 10.4.2 Design Requirements
      3. 10.4.3 Detailed Design Description
      4. 10.4.4 Application Curves
    5. 10.5 Highest Voltage Operation (VCOMP)
      1. 10.5.1 Application Schematic
      2. 10.5.2 Design Requirements
      3. 10.5.3 Detailed Design Description
      4. 10.5.4 Detailed Design Procedure
      5. 10.5.5 Application Curves
    6. 10.6 Reverse Polarity Protection with TPS212x
    7. 10.7 Hotplugging with TPS212x
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Links
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 静电放电警告
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YFP|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.3.4 Thermal Protection (TSD)

The TPS212x devices have built-in absolute thermal shutdown and relative thermal shutdown to ensure maximum reliability of the power mux. The absolute thermal shutdown is designed to disable the power FETs, if the junction temperature exceeds 160°C (typical). The device auto recovers about 25 ms after TJ < [T (TSD) – 10°C]. The relative thermal shutdown protects the device by turning off when the temperature of the power FETs increases sharply such that the FET temperature rises about 60°C above the rest of the die. The device auto recovers about 25 ms after the FETs cools down by 20°C. The relative thermal shutdown is critical for protecting the device against faults such as a power up into a short which causes the FET temperature to increase sharply.