ZHCSNE6 August   2021 TPS1653

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Hot Plug-In and In-Rush Current Control
        1. 8.3.1.1 Thermal Regulation Loop
      2. 8.3.2  Undervoltage Lockout (UVLO)
      3. 8.3.3  Overload and Short Circuit Protection
        1. 8.3.3.1 Overload Protection
        2. 8.3.3.2 Short Circuit Protection
          1. 8.3.3.2.1 Start-Up With Short-Circuit On Output
      4. 8.3.4  Current Monitoring Output (IMON)
      5. 8.3.5  FAULT Response (FLT)
      6. 8.3.6  Power Good Output (PGOOD)
      7. 8.3.7  IN, P_IN, OUT and GND Pins
      8. 8.3.8  Thermal Shutdown
      9. 8.3.9  Low Current Shutdown Control (SHDN)
      10. 8.3.10 Enable Input (EN)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming the Current-Limit Threshold R(ILIM) Selection
        2. 9.2.2.2 Undervoltage Lockout and Overvoltage Set Point
        3. 9.2.2.3 Setting Output Voltage Ramp Time (tdVdT)
          1. 9.2.2.3.1 Support Component Selections RPGOOD and C(IN)
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 48-V Power Amplifier Protection for Telecom Radios
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.7 Typical Characteristics

–40°C ≤ TA = TJ ≤ +125°C, V(IN) = V(P_IN) = 24 V, V( SHDN) = 2 V, R(ILIM) = 30 kΩ, IMON = PGOOD =  FLT = OPEN, C(OUT) = 1 μF, C(dVdT) = OPEN. (Unless stated otherwise)

GUID-20210730-CA0I-3BZJ-C9ND-D2RKRTZTPRCZ-low.pngFigure 6-1 On-Resistance vs Temperature Across Load Current
Figure 6-3 Input Supply Current vs Supply Voltage During Normal Operation
GUID-20210730-CA0I-P7MM-ZL2X-LSXLVBJ0FMH3-low.pngFigure 6-5 Current Monitor Gain vs Output Current
Taken on VQFN device with 95 cm2 copper connected to Exposed PAD
Figure 6-7 Thermal Shutdown Time vs Power Dissipation for RGE Package
Figure 6-2 Input Supply Current vs Supply Voltage in Shutdown
Figure 6-4 Overload Current Limit vs Temperature
GUID-20210730-CA0I-S0MP-C04M-MMZ78GP1V5RB-low.png
IOUT = 4.5 A
Figure 6-6 IMON Offset vs Temperature
Taken on HTSSOP with 110 cm2 copper connected to Exposed PAD
Figure 6-8 Thermal Shutdown Time vs Power Dissipation for PWP Package