ZHCSAK3N December   2012  – February 2022 TPD1E05U06 , TPD4E05U06 , TPD6E05U06

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1.     Absolute Maximum Ratings
    2. 6.1 ESD Ratings—JEDEC Specification
    3. 6.2 ESD Ratings—IEC Specification
    4.     Recommended Operating Conditions
    5. 6.3 Thermal Information
    6. 6.4 Electrical Characteristics
    7. 6.5 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ±15-kV IEC61000-4-2 Level 4 ESD Protection
      2. 7.3.2 IEC61000-4-4 EFT Protection
      3. 7.3.3 IEC61000-4-5 Surge Protection
      4. 7.3.4 I/O Capacitance
      5. 7.3.5 DC Breakdown Voltage
      6. 7.3.6 Ultra-Low Leakage Current
      7. 7.3.7 Low ESD Clamping Voltage
      8. 7.3.8 Industrial Temperature Range
      9. 7.3.9 Easy Flow-Through Routing
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 HDMI 2.0 Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Signal Range on Pin 1, 2, 4, or 5
        3. 8.2.1.3 Application Curves
      2. 8.2.2 HDMI 2.0 Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Signal Range
          2. 8.2.2.2.2 Operating Frequency
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 TPD4E05U06 Layout Example
      2. 10.2.2 TPD1E05U06 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision M (January 2017) to Revision N (February 2022)

  • 将 SOD-523 封装信息从封装尺寸 (0.8mm × 1.2mm) 更新为引线至引线尺寸 (1.60mm × 0.80mm × 0.65mm)Go

Changes from Revision L (January 2017) to Revision M (December 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 更新了特性 部分，以包含SOD-523 封装信息Go
  • 在器件信息 表中添加了 DYA 封装Go
  • Added the DYA package to the Pin Configuration and Functions sectionGo
  • Changed the minimum DC breakdown voltage from 6 V to 6.5 V in the Detailed Description sectionGo
  • Changed the minimum reverse standoff voltage from 5 V to 5.5 V in the Detailed Description sectionGo
  • Updated the Related Documentation sectionGo

Changes from Revision K (November 2016) to Revision L (January 2017)

  • Updated DPY pinout image.Go
  • Updated title from TPD4E05U06 to TPD6E05U06 in Figure 7-3 Go

Changes from Revision J (March 2016) to Revision K (November 2016)

  • Changed min value of VBR from 6 V to 6.5 V in the Electrical Characteristics tableGo

Changes from Revision I (June 2015) to Revision J (March 2016)

  • 将 X2SON 的所有实例替换为 X1SON Go
  • Update the Pin Functions table Go
  • Added the Power Supply Recommendations sectionGo

Changes from Revision H (May 2015) to Revision I (June 2015)

  • 添加了商标Go
  • Corrected TPD6E05U06 Pin 13 nameGo
  • Corrected TLP definitionGo

Changes from Revision G (July 2014) to Revision H (May 2015)

  • 添加了其他应用Go
  • Updated with HDMI 2.0 Eye DiagramsGo

Changes from Revision F (November 2013) to Revision G (July 2014)

  • 新增61000-4-4 EFT 标准Go
  • Added Thermal Information tableGo
  • Added Handling Ratings tableGo
  • Added the Detailed Description sectionGo
  • Added the Application and Implementation sectionGo
  • Added Layout section. Go

Changes from Revision * (December 2012) to Revision A (December 2012)

  • 向文档新增TPS2EUSB30A 器件Go

Changes from Revision A (December 2012) to Revision B (January 2013)

  • Added Insertion Loss Graphic.Go
  • Added Eye Diagrams.Go

Changes from Revision B (January 2013) to Revision C (March 2013)

  • 更改了 IO 电容范围Go
  • Changed test conditions and typ values for Vclamp Go
  • Added typ RDYN values for DQA and RVZ packagesGo
  • Added CL values for DQA and RVZ packagesGo
  • Changed CURRENT vs VOLTAGE graphicGo
  • Changed Insertion Loss graphicGo
  • Changed HDMI Eye DiagramsGo

Changes from Revision C (March 2013) to Revision D ()

  • 更新了“标题”Go
  • Removed Ordering Information table.Go

Changes from Revision D (August 2013) to Revision E (November 2013)

  • 更新了文档格式Go
  • 添加了其他应用Go