ZHCSHR9A March   2018  – June 2018 TPA3138D2

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      采用铁氧体磁珠的 TPA3138 布局
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Analog Gain
      2. 9.3.2  SD/FAULT Operation
      3. 9.3.3  PLIMIT
      4. 9.3.4  Spread Spectrum and De-Phase Control
      5. 9.3.5  GVDD Supply
      6. 9.3.6  DC Detect
      7. 9.3.7  PBTL Select
      8. 9.3.8  Short-Circuit Protection and Automatic Recovery Feature
      9. 9.3.9  Over-Temperature Protection (OTP)
      10. 9.3.10 Over-Voltage Protection (OVP)
      11. 9.3.11 Under-Voltage Protection (UVP)
    4. 9.4 Device Functional Modes
      1. 9.4.1 MODE_SEL = LOW: BD Modulation
      2. 9.4.2 MODE_SEL = HIGH: Low-Idle-Current 1SPW Modulation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 PCB Material Recommendation
        2. 10.2.1.2 PVCC Capacitor Recommendation
        3. 10.2.1.3 Decoupling Capacitor Recommendations
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Ferrite Bead Filter Considerations
        2. 10.2.2.2 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
        3. 10.2.2.3 When to Use an Output Filter for EMI Suppression
        4. 10.2.2.4 Input Resistance
        5. 10.2.2.5 Input Capacitor, Ci
        6. 10.2.2.6 BSN and BSP Capacitors
        7. 10.2.2.7 Differential Inputs
        8. 10.2.2.8 Using Low-ESR Capacitors
      3. 10.2.3 Application Performance Curves
        1. 10.2.3.1 EN55013 Radiated Emissions Results
        2. 10.2.3.2 EN55022 Conducted Emissions Results
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling, CS
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 第三方产品免责声明
    2. 13.2 文档支持
      1. 13.2.1 相关文档
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

PWP Package
28-Pin HTSSOP
(Top View)

Pin Functions

PIN I/O/P(1) DESCRIPTION
NAME NO.
NC 1 – No Connect Pin. Can be shorted to PVCC or shorted to GND or left open.
SD/FAULT 2 IO TTL logic levels with compliance to AVCC. Shutdown logic input for audio amp (LOW , outputs Hi-Z; HIGH , outputs enabled). General fault reporting including Over-Temp, Over-Current, DC Detect. SD/FAULT= High, normal operation, SD/FAULT= Low, fault condition Device will auto-recover once the OT/OC/DC Fault has been removed.
LINP 3 I Positive audio input for left channel. Biased at 2.5 V. Connect to GND for PBTL mode.
LINN 4 I Negative audio input for left channel. Biased at 2.5 V. Connect to GND for PBTL mode.
GAIN_SEL 5 I Gain select least significant bit. TTL logic levels with compliance to AVDD. Low = 20 dB Gain, High = 26 dB Gain, Floating = 26 dB Gain.
MODE_SEL 6 I Mode select least significant bit. TTL logic levels with compliance to AVDD. Low = BD Mode/UV Threshold = 7.5 V, High = Low-Idle-Current 1SPW Mode/UV Threshold = 3.4V, Floating = Low-Idle-Current 1SPW Mode/UV threshold = 3.4V
AVCC 7 P Analog supply.
GND 8 – Analog signal ground.
GVDD 9 O FET gate drive supply. Nominal voltage is 5 V.
PLIMIT 10 I Power limiter level control. Connect a resistor divider from GVDD to GND to set power limit. Connect directly to GVDD for no power limit.
RINN 11 I Negative audio input for right channel. Biased at 2.5 V.
RINP 12 I Positive audio input for right channel. Biased at 2.5 V.
NC 13 – No Connect Pin. Can be shorted to PVCC or shorted to GND or left open.
AGND 14 – Analog signal ground. Connect to the thermal pad.
PVCCR 15, 16 P Power supply for right channel H-bridge. Right channel and left channel power supply inputs are connected internally.
BSPR 17 P Bootstrap supply (BST) for right channel, positive high-side FET.
OUTPR 18 O Class-D H-bridge positive output for right channel.
GND 19 – Power ground for the H-bridges.
OUTNR 20 O Class-D H-bridge negative output for right channel.
BSNR 21 P Bootstrap supply (BST) for right channel, negative high-side FET.
BSNL 22 P Bootstrap supply (BST) for left channel, negative high-side FET.
OUTNL 23 O Class-D H-bridge negative output for left channel.
GND 24 – Power ground for the H-bridges.
OUTPL 25 O Class-D H-bridge positive output for left channel.
BSPL 26 P Bootstrap supply (BST) for left channel, positive high-side FET.
PVCCL 27, 28 P Power supply for left channel H-bridge. Right channel and left channel power supply inputs are connected internally.
Thermal Pad – Connect to GND for best thermal and electrical performance
(1) I = Input, O = Output, IO = Input and Output, P = Power