ZHCS767B January 2012 – April 2016 TPA2080D1
PRODUCTION DATA.
THERMAL METRIC(1) | TPA2080D1 | UNIT | |
---|---|---|---|
YZG (DSBGA) | |||
12 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 97.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 36.7 | °C/W |
RθJB | Junction-to-board thermal resistance | 55.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 13.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 49.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |