ZHCSPX3A October   2022  – November 2022 TMUX7436F

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Electrical Characteristics: Global
    6. 6.6  ±15 V Dual Supply: Electrical Characteristics
    7. 6.7  ±20 V Dual Supply: Electrical Characteristics
    8. 6.8  12 V Single Supply: Electrical Characteristics
    9. 6.9  36 V Single Supply: Electrical Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Input and Output Leakage Current Under Overvoltage Fault
    5. 7.5  Enable Delay Time
    6. 7.6  Break-Before-Make Delay
    7. 7.7  Transition Time
    8. 7.8  Fault Response Time
    9. 7.9  Fault Recovery Time
    10. 7.10 Fault Flag Response Time
    11. 7.11 Fault Flag Recovery Time
    12. 7.12 Charge Injection
    13. 7.13 Off Isolation
    14. 7.14 Crosstalk
    15. 7.15 Bandwidth
    16. 7.16 THD + Noise
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flat ON-Resistance
      2. 8.3.2 Protection Features
        1. 8.3.2.1 Input Voltage Tolerance
        2. 8.3.2.2 Powered-Off Protection
        3. 8.3.2.3 Fail-Safe Logic
        4. 8.3.2.4 Overvoltage Protection and Detection
        5. 8.3.2.5 Adjacent Channel Operation During Fault
        6. 8.3.2.6 ESD Protection
        7. 8.3.2.7 Latch-Up Immunity
        8. 8.3.2.8 EMC Protection
      3. 8.3.3 Overvoltage Fault Flags
      4. 8.3.4 Bidirectional Operation
      5. 8.3.5 1.8 V Logic Compatible Inputs
      6. 8.3.6 Integrated Pull-Down Resistor on Logic Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Fault Mode
      3. 8.4.3 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4.3 Truth Tables

Table 8-1 and Table 8-2 provides the truth tables for the TMUX7436F under normal and fault conditions.

Table 8-1 TMUX7436F Truth Table
EN SEL2 SEL1 Normal Condition Fault Condition
State of Specific Flag (SF) when fault occurs on
On Switch S1A S1B S2A S2B
0 0 0 None 0 1 1 1
0 0 1 None 1 0 1 1
0 1 0 None 1 1 1 0
0 1 1 None 1 1 0 1
1 0 0 S1B, S2B 0 1 1 1
1 0 1 S1A, S2B 1 0 1 1
1 1 0 S1B, S2A 1 1 1 0
1 1 1 S1A, S2A 1 1 0 1

Take note, more than one source pin can be in fault at a given time. As Table 8-1 provides, the SF pin will assert low even when multiple source pins are under fault.

Table 8-2 TMUX7436F DR Truth Table

DR PIN STATE

 Dx State During Fault Condition
0 Pulled up to VDD or VSS
1 Open (HI-Z)

If unused, then SELx pins must be tied to GND to ensure the device does not consume additional current (for more information, refer to Implications of Slow or Floating CMOS Inputs. Unused signal path inputs (Sx or Dx) should be connected to GND.