ZHCSNF7G
February 2021 – July 2024
TMUX7234
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Thermal Information
5.4
Recommended Operating Conditions
5.5
Source or Drain Continuous Current
5.6
±15 V Dual Supply: Electrical Characteristics
5.7
±15 V Dual Supply: Switching Characteristics
5.8
±20 V Dual Supply: Electrical Characteristics
5.9
±20 V Dual Supply: Switching Characteristics
5.10
44 V Single Supply: Electrical Characteristics
5.11
44 V Single Supply: Switching Characteristics
5.12
12 V Single Supply: Electrical Characteristics
5.13
12 V Single Supply: Switching Characteristics
5.14
Typical Characteristics
6
Parameter Measurement Information
6.1
On-Resistance
6.2
Off-Leakage Current
6.3
On-Leakage Current
6.4
Transition Time
6.5
tON(EN) and tOFF(EN)
6.6
Break-Before-Make
6.7
tON (VDD) Time
6.8
Propagation Delay
6.9
Charge Injection
6.10
Off Isolation
6.11
Crosstalk
6.12
Bandwidth
6.13
THD + Noise
6.14
Power Supply Rejection Ratio (PSRR)
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Bidirectional Operation
7.3.2
Rail-to-Rail Operation
7.3.3
1.8 V Logic Compatible Inputs
7.3.4
Fail-Safe Logic
7.3.5
Latch-Up Immune
7.3.6
Ultra-Low Charge Injection
7.4
Device Functional Modes
7.5
Truth Tables
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
支持资源
11.4
Trademarks
11.5
静电放电警告
11.6
术语表
12
Revision History
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
PW|20
MPDS362A
RRQ|20
MPQF551
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsnf7g_oa
zhcsnf7g_pm
11.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。