4 Revision History
Changes from Revision B (April 2021) to Revision C (July 2021)
- 添加了对 TSSOP 封装的高电流支持Go
- 将 TMUX621x 的 QFN 封装状态从预发布 更改为正在供货
Go
- Added ESD detail for RUM packageGo
- Changed THD+N typical for 12V supplyGo
- Added the Integrated Pull-Down Resistor on Logic Pins
sectionGo
- Updated the Ultra-Low Charge Injection
sectionGo
- Updated the TMUX621x Layout Example FigureGo
Changes from Revision A (January 2021) to Revision B (April 2021)
- Added thermal information for QFN packageGo
- Updated IDC specs for TSSOP package in Source or Drain Continuous Current table Go
- Added IDC specs for QFN package in Source or Drain Continuous Current table Go
- Included Break-before-make time delay for TMUX6213Go
- Updated VDD rise time value from 100ns to 1µs in TON(VDD) test conditionGo
- Updated CL value from 1nF to 100pF in Charge Injection test conditionGo
Changes from Revision * (October 2020) to Revision A (January 2021)