ZHCSKY9E March   2020  – October 2022 TMUX1308 , TMUX1309

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: TMUX1308
    5. 7.5  Thermal Information: TMUX1309
    6. 7.6  Electrical Characteristics
    7. 7.7  Logic and Dynamic Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Injection Current Coupling
    10. 7.10 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  Break-Before-Make
    6. 8.6  tON(EN) and tOFF(EN)
    7. 8.7  Charge Injection
    8. 8.8  Off Isolation
    9. 8.9  Crosstalk
    10. 8.10 Bandwidth
    11. 8.11 Injection Current Control
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail-to-Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Fail-Safe Logic
      5. 9.3.5 Injection Current Control
        1. 9.3.5.1 TMUX13xx is Powered, Channel is Unselected, and the Input Signal is Greater Than VDD (VDD = 5 V, VINPUT = 5.5 V)
        2. 9.3.5.2 TMUX13xx is Powered, Channel is Selected, and the Input Signal is Greater Than VDD (VDD = 5 V, VINPUT = 5.5 V)
        3. 9.3.5.3 TMUX13xx is Unpowered and the Input Signal has a Voltage Present (VDD = 0 V, VINPUT = 3 V)
    4. 9.4 Device Functional Modes
    5. 9.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

TMUX1308TMUX1309 为通用互补金属氧化物半导体 (CMOS) 多路复用器 (MUX)。TMUX1308 是 8:1
单通道(单端)多路复用器,
TMUX1309 是 4:1 双通道(差分)多路复用器。这些器件可在源极 (Sx) 和漏极 (Dx) 引脚上支持从 GND 到 VDD 范围的双向模拟和数字信号。

TMUX13xx 器件具有内部注入电流控制功能,从而无需外部二极管和电阻器网络(通常用于保护开关并使输入信号保持在电源电压范围之内)。内部注入电流控制电路允许禁用信号路径上的信号超过电源电压,而不会影响启用信号路径的信号。此外,TMUX13xx 器件没有到电源引脚的内部二极管路径,从而消除了损坏连接到电源引脚的元件或为电源轨提供意外电源的风险。

所有逻辑输入均具有兼容 1.8 V 逻辑的阈值,在有效电源电压下运行时,这些阈值可确保 TTL 和 CMOS 逻辑兼容性。失效防护逻辑电路允许先在控制引脚上施加电压,然后在电源引脚上施加电压,从而保护器件免受潜在的损害。

封装信息(1)(2)
器件型号 封装 封装尺寸(标称值)
TMUX1308TMUX1309 PW(TSSOP,16) 5.00mm × 4.40mm
DYY(SOT-23-THIN,16) 4.20mm × 2.00mm
BQB(WQFN,16) 3.50mm × 2.50mm
如需了解所有可用封装,请参阅数据表末尾的封装选项附录。
请参阅器件比较表