ZHCSJ00F january   2010  – june 2023 TMS3705

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Functional Block Diagram
  6. Revision History
  7. Device Characteristics
    1. 6.1 Related Products
  8. Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions
  9. Specifications
    1. 8.1 Absolute Maximum Ratings #GUID-D01738F0-6DD5-4A5A-BE33-2BC076228CBE/AMR001
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Electrical Characteristics
    5. 8.5 Thermal Resistance Characteristics for D (SOIC) Package
    6. 8.6 Switching Characteristics
    7. 8.7 Timing Diagrams
  10. Detailed Description
    1. 9.1  Power Supply
    2. 9.2  Oscillator
    3. 9.3  Predrivers
    4. 9.4  Full Bridge
    5. 9.5  RF Amplifier
    6. 9.6  Band-Pass Filter and Limiter
    7. 9.7  Diagnosis
    8. 9.8  Power-on Reset
    9. 9.9  Frequency Divider
    10. 9.10 Digital Demodulator
    11. 9.11 Transponder Resonance-Frequency Measurement
    12. 9.12 SCI Encoder
    13. 9.13 Control Logic
    14. 9.14 Test Pins
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Diagram
  12. 11Device and Documentation Support
    1. 11.1 Getting Started and Next Steps
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation Support
    5. 11.5 支持资源
    6. 11.6 Trademarks
    7. 11.7 静电放电警告
    8. 11.8 术语表
  13. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of devices. Each device has one of three prefixes: X, P, or null (no prefix) (for example, TMS3705).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

X and P devices are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, D). Figure 11-1 provides a legend for reading the complete device name.

For orderable part numbers of TMS3705 devices in the D package types, see the Package Option Addendum in Section 12, the TI website, or contact your TI sales representative.

GUID-39CE941E-457B-4DF2-8A16-69F439152224-low.gifFigure 11-1 Device Nomenclature