ZHCSH87B September   2017  – February 2020 TMP461-SP

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
    1.     简化框图
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
        1. 7.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
        2. 7.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Filtering
      5. 7.3.5 Sensor Fault
      6. 7.3.6 ALERT and THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 General-Call Reset
    6. 7.6 Register Map
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Local and Remote Temperature Registers
        3. 7.6.1.3  Status Register
        4. 7.6.1.4  Configuration Register
        5. 7.6.1.5  Conversion Rate Register
        6. 7.6.1.6  One-Shot Start Register
        7. 7.6.1.7  Channel Enable Register
        8. 7.6.1.8  Consecutive ALERT Register
        9. 7.6.1.9  η-Factor Correction Register
        10. 7.6.1.10 Remote Temperature Offset Register
        11. 7.6.1.11 Manufacturer Identification Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Radiation Environments
      1. 8.3.1 Single Event Latch-Up
      2. 8.3.2 Single Event Functional Interrupt
      3. 8.3.3 Single Event Upset
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

HKU Package
10-Pin CFP
Top View

Pin Functions

PIN TYPE DESCRIPTION
NAME NO.
A0 5 Digital input Address select. Connect to GND, V+, or leave floating.
A1 10 Digital input Address select. Connect to GND, V+, or leave floating.
ALERT/THERM2 7 Digital output Interrupt or SMBus alert output. Can be configured as a second THERM output.
Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
D– 3 Analog input Negative connection to remote temperature sensor.
D+ 2 Analog input Positive connection to remote temperature sensor.
GND 6 Ground Supply ground connection.
SCL 9 Digital input Serial clock line for SMBus.
Input; requires a pullup resistor to a voltage between 1.7 V and 3.6 V if driven by an open-drain output.
SDA 8 Bidirectional digital input-output Serial data line for SMBus. Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
THERM 4 Digital output Thermal shutdown or fan-control pin.
Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
V+ 1 Power supply Positive supply voltage, 1.7 V to 3.6 V.
Thermal Pad(1) -- -- The exposed thermal pad of the HKU package should be connected to a wide ground plane for effective thermal conduction.
(1) Thermal pad and package lid are internally connected to ground.