ZHCSIJ9A May   2009  – July 2018 TLC5952

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路（多个菊链式 TLC5952）
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Pin Equivalent Input and Output Schematic Diagrams
    2. 7.2 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Maximum Constant-Sink-Current Value
      2. 8.3.2 Global Brightness Control (BC) Function: Sink-Current Control
      3. 8.3.3 Constant-Current Output On-Off Control
    4. 8.4 Device Functional Modes
      1. 8.4.1 LOD, LSD, and TEF Operation
      2. 8.4.2 Register and Data Latch Configuration
        1. 8.4.2.1 Output On-Off Data Latch
        2. 8.4.2.2 Control-Data Latch
        3. 8.4.2.3 Status Information Data (SID)
        4. 8.4.2.4 LED-Open Detection (LOD), LED-Short Detection (LSD), And Thermal Error Flag (TEF)
        5. 8.4.2.5 Thermal Shutdown (TSD)
        6. 8.4.2.6 Noise Reduction
  9. 9 Power Supply Recommendations
  10. 10器件和文档支持
    1. 10.1 接收文档更新通知
    2. 10.2 社区资源
    3. 10.3 商标
    4. 10.4 静电放电警告
    5. 10.5 术语表
  11. 11机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TLC5952 UNIT
DAP (TSSOP)
32 PINS
RθJA Junction-to-ambient thermal resistance 28.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20.6 °C/W
RθJB Junction-to-board thermal resistance 10.7 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 10.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.6 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.