ZHCSNF4A June   2016  – February 2021 THS6302

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

GUID-5EEA04CB-B613-40E0-8BE0-C27A6195D338-low.gif Figure 5-1 RHF Package 28-Pin VQFN Top View
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
IREF 1 — Bias current reference pin
INA+ 2 I Positive input for channel A
INA– 3 I Negative input for channel A
INB+ 7 I Positive input for channel B
INB– 6 I Negative input for channel B
OUTA+ 27 O Positive output for channel A
OUTA– 25 O Negative output for channel A
OUTB+ 10 O Positive output for channel B
OUTB– 12 O Negative output for channel B
M11 28 I Most significant bit (MSB) of channel A
M12 26 I Least significant bit (LSB) of channel A
M21 9 I MSB of channel B
M22 11 I LSB of channel B
VS 16, 18, 19, 20 — Positive supply voltage connection
GND 4, 5, 17, 21 — Ground
NC 8, 13, 14, 15, 22, 23, 24 — Not connected
Thermal pad — Device thermal pad, connected to ground