ZHCSGR2D August   2017  – February 2021 THS4561

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS+ – VS– = 5 V to 12 V
    6. 7.6 Typical Characteristics: (VS+) – (VS–) = 12 V
    7. 7.7 Typical Characteristics: (VS+) – (VS–) = 5 V
    8. 7.8 Typical Characteristics: (VS+) – (VS–) = 3 V
    9. 7.9 Typical Characteristics: (VS+) – (VS–) = 3-V to 12-V Supply Range
  8. 8 Parameter Measurement Information
    1. 8.1 Example Characterization Circuits
    2. 8.2 Output Interface Circuit for DC-Coupled Differential Testing
    3. 8.3 Output Common-Mode Measurements
    4. 8.4 Differential Amplifier Noise Measurements
    5. 8.5 Balanced Split-Supply Versus Single-Supply Characterization
    6. 8.6 Simulated Characterization Curves
    7. 8.7 Terminology and Application Assumptions
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down Mode
      2. 9.4.2 Single-Ended Source to Differential Output Mode
        1. 9.4.2.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversions
        2. 9.4.2.2 DC-Coupled Input Signal Path Considerations for Single-Ended to Differential Conversions
      3. 9.4.3 Differential Input to a Differential Output Mode
        1. 9.4.3.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Differential Open-Loop Gain and Output Impedance
      2. 10.1.2 Setting Resistor Values Versus Gain
      3. 10.1.3 Noise Analysis
      4. 10.1.4 Factors Influencing Harmonic Distortion
      5. 10.1.5 Input Overdrive Performance
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Board Layout Recommendations
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 接收文档更新通知
    2. 13.2 支持资源
    3. 13.3 Trademarks
    4. 13.4 静电放电警告
    5. 13.5 术语表
  14. 14Mechanical, Packaging, and Orderable Information

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13.4 静电放电警告

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。