ZHCSJ49F March 2017 – February 2019 TDA2P-ACD
请参考 PDF 数据表获取器件具体的封装图。
If separate power planes are used, they must be tied together at one point through a low-impedance bridge or preferably through a ferrite bead. Care must be taken to capacitively decouple each power rail close to the device. The analog ground, digital ground, and PLL ground must be tied together to the low-impedance circuit board ground plane.