ZHCSN36B February   2021  – November 2021 TCAN1057A-Q1 , TCAN1057AV-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings Table — IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Characteristics
    6. 6.6 Supply Characteristics
    7. 6.7 Dissipation Ratings
    8. 6.8 Electrical Characteristics
    9. 6.9 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Description
        1. 8.3.1.1 TXD
        2. 8.3.1.2 GND
        3. 8.3.1.3 VCC
        4. 8.3.1.4 RXD
        5. 8.3.1.5 VIO
        6. 8.3.1.6 CANH and CANL
        7. 8.3.1.7 S (Silent)
      2. 8.3.2 CAN Bus States
      3. 8.3.3 TXD Dominant Timeout (DTO)
      4. 8.3.4 CAN Bus short-circuit current limiting
      5. 8.3.5 Thermal Shutdown (TSD)
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Unpowered Device
      8. 8.3.8 Floating pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
      2. 8.4.2 Normal Mode
      3. 8.4.3 Silent Mode
      4. 8.4.4 Driver and Receiver Function
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 CAN Termination
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
      3. 9.2.3 Application Curves
      4. 9.2.4 System Examples
  10. 10Power Supply Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

Figure 5-1 DDF Package, 8-Pin SOT, Top View
Figure 5-3 DRB Package, 8-Pin VSON, Top View
Figure 5-2 D Package, 8-Pin SOIC, Top View
Table 5-1 Pin Functions
PinsTypeDescription
NameNo.
TXD1Digital InputCAN transmit data input, integrated pull-up
GND2GNDGround connection
VCC3Supply5-V supply voltage
RXD4Digital OutputCAN receive data output, tri-state when powered off
NC5—No connect (not internally connected); devices without VIO
VIOSupplyI/O supply voltage
CANL6Bus IOLow-level CAN bus input/output line
CANH7Bus IOHigh-level CAN bus input/output line
S8Digital InputSilent mode control input, integrated pull-up
Thermal Pad (VSON only)—Connect the thermal pad to any internal PCB ground plane using multiple vias for optimal thermal performance.