ZHCSJJ3E July   2009  – April 2019 TCA9555

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 5-V Tolerant I/O Ports
      2. 9.3.2 Hardware Address Pins
      3. 9.3.3 Interrupt (INT) Output
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-On Reset (POR)
      2. 9.4.2 Powered-Up
    5. 9.5 Programming
      1. 9.5.1 I/O Port
      2. 9.5.2 I2C Interface
        1. 9.5.2.1 Bus Transactions
          1. 9.5.2.1.1 Writes
          2. 9.5.2.1.2 Reads
      3. 9.5.3 Device Address
      4. 9.5.4 Control Register and Command Byte
    6. 9.6 Register Maps
      1. 9.6.1 Register Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Calculating Junction Temperature and Power Dissipation
        2. 10.2.2.2 Minimizing ICC When I/O Is Used to Control LED
        3. 10.2.2.3 Pull-Up Resistor Calculation
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.6 I2C Interface Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 19)
MIN MAX UNIT
I2C BUS—STANDARD MODE
fscl I2C clock frequency 0 100 kHz
tsch I2C clock high time 4 µs
tscl I2C clock low time 4.7 µs
tsp I2C spike time 50 ns
tsds I2C serial-data setup time 250 ns
tsdh I2C serial-data hold time 0 ns
ticr I2C input rise time 1000 ns
ticf I2C input fall time 300 ns
tocf I2C output fall time 10-pF to 400-pF bus 300 ns
tbuf I2C bus free time between stop and start 4.7 µs
tsts I2C start or repeated start condition setup 4.7 µs
tsth I2C start or repeated start condition hold 4 µs
tsps I2C stop condition setup 4 µs
tvd(data) Valid data time SCL low to SDA output valid 3.45 µs
tvd(ack) Valid data time of ACK condition ACK signal from SCL low to
SDA (out) low		 3.45 µs
Cb I2C bus capacitive load 400 pF
I2C BUS—FAST MODE
fscl I2C clock frequency 0 400 kHz
tsch I2C clock high time 0.6 µs
tscl I2C clock low time 1.3 µs
tsp I2C spike time 50 ns
tsds I2C serial-data setup time 100 ns
tsdh I2C serial-data hold time 0 ns
ticr I2C input rise time 20 300 ns
ticf I2C input fall time 20 × (VCC / 5.5 V) 300 ns
tocf I2C output fall time 10-pF to 400-pF bus 20 × (VCC / 5.5 V) 300 ns
tbuf I2C bus free time between stop and start 1.3 µs
tsts I2C start or repeated start condition setup 0.6 µs
tsth I2C start or repeated start condition hold 0.6 µs
tsps I2C stop condition setup 0.6 µs
tvd(data) Valid data time SCL low to SDA output valid 0.9 µs
tvd(ack) Valid data time of ACK condition ACK signal from SCL low to
SDA (out) low		 0.9 µs
Cb I2C bus capacitive load 400 pF