ZHCS794B February   2012  – August 2015 SN75DP126

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Supply Electrical Characteristics
    6. 7.6  Main Link Input Electrical Characteristics
    7. 7.7  DisplayPort Main Link Output Electrical Characteristics
    8. 7.8  HDMI/DVI Main Link Output Electrical Characteristics
    9. 7.9  HPD/CAD/EN Electrical Characteristics
    10. 7.10 AUX/DDC/I2C Electrical Characteristics
    11. 7.11 DisplayPort Main Link Output Switching Characteristics
    12. 7.12 HDMI/DVI Main Link Switching Characteristics
    13. 7.13 HPD/CAD Switching Characteristics
    14. 7.14 AUX/DDC/I2C Switching Characteristics
    15. 7.15 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Implementing the EN Signal
      2. 8.3.2 Hot Plug Detect (HPD) and Cable Adapter Detect (CAD) Description
      3. 8.3.3 OVS Function Description
      4. 8.3.4 AUX and DDC Configuration Details
      5. 8.3.5 Source-Side Main Link EQ Configuration Details
      6. 8.3.6 DP-HDMI Adaptor ID Buffer
      7. 8.3.7 GPU with a Unified AUX/DDC Configuration
      8. 8.3.8 GPU with Separate DDC and AUX Channels
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes Overview
    5. 8.5 Register Maps
      1. 8.5.1 Link Training and DPCD Description
      2. 8.5.2 Local I2C Interface Overview
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 AC Coupling Capacitors
        2. 9.2.2.2 Configuration Options
        3. 9.2.2.3 Dual Layout for Single or Dual Power Supply
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Analog vs Digital vs High Power
    2. 10.2 Analog Power-Supply Pins and Analog Reference Voltages
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layer Stack
      2. 11.1.2 Power Plane Do's and Don'ts for Four-Layer Boards
      3. 11.1.3 Differential Traces
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 社区资源
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.2 商标

E2E is a trademark of Texas Instruments.

显示端口 is a trademark of VESA Standards Association.

All other trademarks are the property of their respective owners.

12.3 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.