ZHCSRD0H August   1987  – January 2023 SN65ALS180 , SN75ALS180

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics - Driver
    5. 5.5 Switching Characteristics - Driver
    6. 5.6 Symbol Equivalents
    7. 5.7 Electrical Characteristics - Receivers
    8. 5.8 Switching Characteristics - Receivers
    9. 5.9 Typical Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|14
  • N|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Thermal Information

THERMAL METRIC(1)N (PDIP)D (SOIC)
(SN65 Devices)		D (SOIC)
(SN75 Devices)		UNIT
14-Pins

14-Pins

14-Pins
R θJAJunction-to-ambient thermal resistance53.493.283.7°C/W
R θJC(top)Junction-to-case thermal resistance4047.539.8°C/W
R θJBJunction-to-board thermal resistance33.349.439.7°C/W
ψ JTJunction-to-top characterization parameter111.27.2°C/W
ψ JBJunction-to-board characterization parameter3348.9

39.7

°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.