ZHCSIG9D September   2003  – July 2018 SN74CB3Q3257

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     逻辑图(正逻辑)
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics, VCC = 2.5 V
    7. 6.7 Switching Characteristics, VCC = 3.3 V
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|16
  • DBQ|16
  • RGY|16
  • DGV|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

D, DB, DGV, DBQ, or PW Package
16-Pin SOIC, SSOP TVSOP, or TSSOP
Top View
RGY Package
16-Pin VQFN
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
S 1 I Select Pin
1B1 2 I/O Channel 1 I/O 1
1B2 3 I/O Channel 1 I/O 2
1A 4 I/O Channel 1 common
2B1 5 I/O Channel 2 I/O 1
2B2 6 I/O Channel 2 I/O 2
2A 7 I/O Channel 2 common
GND 8 Ground
3A 9 I/O Channel 3 common
3B2 10 I/O Channel 3 I/O 2
3B1 11 I/O Channel 3 I/O 1
4A 12 I/O Channel 4 common
4B2 13 I/O Channel 4 I/O 2
4B1 14 I/O Channel 4 I/O 1
OE 15 I Output Enable (Active Low)
VCC 16 Power