ZHCSIG9D September   2003  – July 2018 SN74CB3Q3257

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     逻辑图（正逻辑）
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics, VCC = 2.5 V
    7. 6.7 Switching Characteristics, VCC = 3.3 V
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|16
  • DBQ|16
  • RGY|16
  • DGV|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) SN74CB3Q3257 UNIT
DBQ (SSOP) DGV (TVSOP) PW (TSSOP) RGY (VQFN)
16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 114.3 126.0 112.7 49.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 65.4 51.3 47.5 61.2
RθJB Junction-to-board thermal resistance 56.8 57.8 57.8 25.9
ψJT Junction-to-top characterization parameter 18.3 5.9 6.0 2.3
ψJB Junction-to-board characterization parameter 56.4 57.3 57.3 26.0
RθJC(bot) Junction-to-case (bottom) thermal resistance - - - 11.4
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.