ZHCSRD0 数据表 | 德州仪器 TI.com.cn

ZHCSRD0H August 1987 – January 2023 SN65ALS180 , SN75ALS180

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC⁽¹⁾		N (PDIP)	D (SOIC) (SN65 Devices)	D (SOIC) (SN75 Devices)	UNIT
THERMAL METRIC⁽¹⁾		14-Pins	14-Pins	14-Pins	UNIT
R _θJA	Junction-to-ambient thermal resistance	53.4	93.2	83.7	°C/W
R _θJC(top)	Junction-to-case thermal resistance	40	47.5	39.8	°C/W
R _θJB	Junction-to-board thermal resistance	33.3	49.4	39.7	°C/W
ψ _JT	Junction-to-top characterization parameter	1	11.2	7.2	°C/W
ψ _JB	Junction-to-board characterization parameter	33	48.9	39.7	°C/W
R _θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.