ZHCSM80G October   2020  – September 2023 REF70

PRODMIX  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  REF7012 Electrical Characteristics
    6. 7.6  REF7025 Electrical Characteristics
    7. 7.7  REF7030 Electrical Characteristics
    8. 7.8  REF7033 Electrical Characteristics
    9. 7.9  REF7040 Electrical Characteristics
    10. 7.10 REF7050 Electrical Characteristics
    11. 7.11 Typical Characteristics
  9. 8 Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Long-Term Stability
    3. 8.3 Thermal Hysteresis
    4. 8.4 Noise Performance
      1. 8.4.1 1/f Noise
      2. 8.4.2 Broadband Noise
    5. 8.5 Temperature Drift
    6. 8.6 Power Dissipation
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 EN Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Basic Connections
      2. 9.4.2 Negative Reference Voltage
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Application: Basic Voltage Reference Connection
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Input and Output Capacitors
            1. 10.2.1.2.1.1 Application Curve
          2. 10.2.1.2.2 Force and Sense Connection
      2. 10.2.2 Typical Application: DAC Force and Sense Reference Drive Circuit
        1. 10.2.2.1 Design Requirements
    3. 10.3 Power Supply Recommendation
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision F (March 2023) to Revision G (September 2023)

  • Update table to highlight REF7025 and REF7040 release in VSSOP packageGo
  • Added performance parameters for VSSOP packageGo
  • Added performance parameters for VSSOP packageGo
  • Changed Figure 7-25 to longer duration (10000 hours)Go
  • Added Figure 7-27 Go
  • Changed Figure 8-4 and Figure 8-4, to longer duration (10000 hours)Go
  • Changed Figure 8-10, to highlight performance at different supply voltagesGo
  • Changed minimum ESR value from 10 mΩ to 1 mΩGo
  • Changed minimum ESR value from 10 mΩ to 1 mΩ.Go

Changes from Revision E (July 2022) to Revision F (March 2023)

  • 向电压选项特性中添加换行符以提高可读性。Go
  • 删除了 VSSOP 封装预发布脚注。Go
  • Added footnote to indicate VSSOP package preview materialGo
  • Added performance parameters for VSSOP packageGo
  • Added performance graphs for VSSOP package devicesGo
  • Added solder shift histogram for VSSOP package.Go
  • Added long term stability details for VSSOP package.Go
  • Added thermal hysteresis details for VSSOP package.Go
  • Added layout details for VSSOP package.Go

Changes from Revision D (November 2021) to Revision E (July 2022)

  • 根据文档反馈更新了“长期稳定性”特性文本，并根据执行的其他测试将数字从 28ppm 更新为 35ppmGo
  • 向“器件信息”表添加了针对 VSSOP 封装的脚注Go
  • Updated Long-term stability numbers to reflect latest evaluation resultsGo
  • Changed Figure 7-25 to longer duration (4000 hours)Go
  • Changed Figure 8-4, to longer duration (4000 hours)Go

Changes from Revision C (September 2021) to Revision D (November 2021)

  • Changed REF7012 status from Preproduction device to Released deviceGo
  • Changed REF7012 status to Released Device. Updated specifications to meet production release device.Go
  • Added REF7030 Electrical Characteristics tableGo
  • Added REF7033 Electrical Characteritics tableGo
  • Added REF7012 Thermal Hysteresis figureGo
  • Added JEDEC standard details to follow for solder reflow profiles. Updated solder shift histogram plot.Go
  • Added Thermal Hysteresis plots for REF7012 device Go

Changes from Revision B (April 2021) to Revision C (September 2021)

  • 在第 1 页上向“特性”中添加了 1.25V 型号Go
  • In the Device Comparison Table, added the 1.25V variant and added foot notes to indicate which devices are released vs pre-production Go
  • Changed Dropout voltage to min VIN = 2.75 V for VOUT < 2.5 V. Go
  • Added Electrical Characteristics table for REF7012 (Product Preview)Go
  • Changed VINMIN from 3 V to VOUT + VDO Go
  • Added Electrical Characteristics table for REF7040 (Product Preview)Go
  • Added Electrical Characteristics table for REF7050 (Product Preview)Go
  • Added to the notes above the Typical Characteristics plots, Vref = 2.5 V to the default conditionsGo
  • Under Temperature Drift section of the Parameter Measurement Information, corrected the figure from Long Term Drift plot to Temperature DriftGo

Changes from Revision A (December 2020) to Revision B (April 2021)

  • 在标题和器件信息中将 REF7025 更改为更通用的 REF70 系列添加了 ADC 配套产品Go
  • Changed Figures 7-2 and 7-20, Long-Term Stability (First 1000 Hours), to longer duration (2000 hours)Go
  • Corrected typical shift from 0.021% to 0.009%Go
  • Changed Figure 8-3, Long-Term Stability LCCC -1000 hours), to longer duration (2000 hours)Go
  • Corrected Figure 8-5, Thermal Hysteresis Distribution Cycle 2 (-40°C to 125°C), data and titleGo
  • Reordered figures and paragraphs for better flow.Go
  • Changed VREF to VREF(25°C) in Equation 2.Go
  • Added missing supply bypass capacitor value (10-μF)Go
  • Clarified piezoelectric contribution to noise and added links to resources.Go
  • Added clarification on how to connect OUTF and OUTS in specific load current condition.Go
  • Corrected part numbers and added links in Table 10-2, Reference Op Amp Options Go

Changes from Revision * (October 2020) to Revision A (December 2020)

  • APL 到 RTM 发布Go