ZHCSM80G October   2020  – September 2023 REF70

PRODMIX  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  REF7012 Electrical Characteristics
    6. 7.6  REF7025 Electrical Characteristics
    7. 7.7  REF7030 Electrical Characteristics
    8. 7.8  REF7033 Electrical Characteristics
    9. 7.9  REF7040 Electrical Characteristics
    10. 7.10 REF7050 Electrical Characteristics
    11. 7.11 Typical Characteristics
  9. Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Long-Term Stability
    3. 8.3 Thermal Hysteresis
    4. 8.4 Noise Performance
      1. 8.4.1 1/f Noise
      2. 8.4.2 Broadband Noise
    5. 8.5 Temperature Drift
    6. 8.6 Power Dissipation
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 EN Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Basic Connections
      2. 9.4.2 Negative Reference Voltage
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Application: Basic Voltage Reference Connection
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Input and Output Capacitors
            1. 10.2.1.2.1.1 Application Curve
          2. 10.2.1.2.2 Force and Sense Connection
      2. 10.2.2 Typical Application: DAC Force and Sense Reference Drive Circuit
        1. 10.2.2.1 Design Requirements
    3. 10.3 Power Supply Recommendation
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.