SBOS708C May   2016  – April 2026 REF60

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-A787C102-7D46-49D3-80D0-980BFF94C990/SBOS600118
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
    2. 7.2 Thermal Hysteresis
    3. 7.3 Reference Droop Measurements
    4. 7.4 1/f Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Integrated ADC Drive Buffer
      2. 8.3.2 Temperature Drift
      3. 8.3.3 Load Current
      4. 8.3.4 Stability
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Results
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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11 Revision History

Changes from Revision B (August 2016) to Revision C (April 2026)

  • Moved the REF6025, REF6030, REF6033, REF6041, REF6045, REF6050 devices to the REF60 product folder on TI.com and updated the datasheet headerGo
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed Device Information table to Package Information Go

Changes from Revision A (June 2016) to Revision B (August 2016)

  • Changed the Description Go
  • Changed the Description Go
  • Changed the Device Comparison Table Go
  • Changed list of devices for output current in Recommended Operating Conditions Go
  • Changed load regulation max value for REF6050 at TA = –40°C to +125°C from 30 to 50Go
  • Changed Figure 2Go
  • Changed "second pass" to "final pass" in last paragraph of Solder Heat Shift section Go
  • Added link to SLYY097 in Overview sectionGo