SBOS708C May   2016  – April 2026 REF60

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-A787C102-7D46-49D3-80D0-980BFF94C990/SBOS600118
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Solder Heat Shift
    2. 7.2 Thermal Hysteresis
    3. 7.3 Reference Droop Measurements
    4. 7.4 1/f Noise Performance
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Integrated ADC Drive Buffer
      2. 8.3.2 Temperature Drift
      3. 8.3.3 Load Current
      4. 8.3.4 Stability
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Results
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±1000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±250
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.