SBOS708C
May 2016 – April 2026
REF60
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings #GUID-A787C102-7D46-49D3-80D0-980BFF94C990/SBOS600118
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Parameter Measurement Information
7.1
Solder Heat Shift
7.2
Thermal Hysteresis
7.3
Reference Droop Measurements
7.4
1/f Noise Performance
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Integrated ADC Drive Buffer
8.3.2
Temperature Drift
8.3.3
Load Current
8.3.4
Stability
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Results
9.2.3
Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DGK|8
MPDS028E
|
散热焊盘机械数据 (封装 | 引脚)
订购信息
sbos708c_oa
6.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±1000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±250
(1)
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.