ZHCSGP2F September   2017  – June 2021 REF3425 , REF3430 , REF3433 , REF3440 , REF3450

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Long-Term Stability
    3. 8.3 Thermal Hysteresis
    4. 8.4 Power Dissipation
    5. 8.5 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply Voltage
      2. 9.3.2 Low Temperature Drift
      3. 9.3.3 Load Current
    4. 9.4 Device Functional Modes
      1. 9.4.1 EN Pin
      2. 9.4.2 Negative Reference Voltage
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application: Basic Voltage Reference Connection
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input and Output Capacitors
        2. 10.2.2.2 4-Wire Kelvin Connections
        3. 10.2.2.3 VIN Slew Rate Considerations
        4. 10.2.2.4 Shutdown/Enable Feature
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

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7.5 Electrical Characteristics

At VIN = VOUT + VDO, COUT = 10 µF, CIN = 0.1 µF, IL = 0 mA, minimum and maximum specifications at TA = –40℃ to 125℃; Typical specifications at TA = 25℃ unless otherwise noted
PARAMETER TEST CONDITION MIN TYP MAX UNIT
ACCURACY AND DRIFT
Output voltage accuracy TA = 25℃ –0.05 0.05 %
Output voltage temperature coefficient (1)  –40°C ≤ TA ≤ 125°C 2.5 6 ppm/°C
LINE & LOAD REGULATION
ΔVO/ΔVIN Line Regulation VIN = VOUT + VDO (2) to 12 V 2 15 ppm/V
ΔVO/ΔIL Load Regulation IL = 0 mA to 10mA, VIN = VOUT+ VDO (3) Sourcing 20 30 ppm/mA
IL = 0 mA to –10mA, VIN = VOUT+ VDO,  TA = 25°C (3) Sinking, REF3425 40 70
Sinking, REF3430 43 75
Sinking, REF3433 48 84
Sinking, REF3440 60 98
Sinking, REF3450 70 140
ISC Short circuit current VOUT = 0 V at TA = 25°C 18 22 mA
NOISE
enp-p Low frequency noise (4) 0.1Hz ≤ f ≤ 10Hz 5 µVp-p/V
0.1Hz ≤ f ≤ 10Hz (REF3440 and REF3450) 3.8
en Integrated wide band noise 10Hz ≤ f ≤ 10kHz 24 µVrms
en Output voltage noise density f = 1kHz 0.25 ppm/√Hz
 
f = 1kHz (REF3440 and REF3450) 0.2
LONG TERM STABILITY AND HYSTERESIS
Long-term stability (5) DBV Package 0 to 1000h at 35°C 25 ppm
1000h to 2000h at 35°C  10
Output voltage thermal hysteresis (6) DBV Package 25°C, –40°C,125°C, 25°C Cycle 1 30 ppm
25°C, –40°C,125°C, 25°C Cycle 2 10
TURN-ON TIME
tON Turn-on time 0.1% of output voltage settling, CL = 10 µF 2.5 ms
CAPACITIVE LOAD
CL Stable output capacitor range  –40°C ≤ TA ≤ 125°C 0.1 10 µF
OUTPUT VOLTAGE
VOUT Output voltage REF3425, REF3425T 2.5 V
REF3430, REF3430T 3.0
REF3433, REF3433T 3.3
REF3440, REF3440T 4.096
REF3450, REF3450T 5.0
POWER SUPPLY
VIN Input voltage VOUT + VDO 12 V
IL Output current capacity VIN = VOUT + VDO to 12 V –10 10 mA
IQ Quiescent current Active mode 72 95 µA
Shutdown mode 2.5 3
VEN ENABLE pin voltage Voltage reference in active mode (EN = 1) 1.6 V
Voltage reference in shutdown mode (EN = 0) 0.5
VDO Dropout voltage IL = 0 mA 50 100 mV
IL = 10 mA 500
IEN ENABLE pin leakage current VEN = VIN = 12V 1 2 µA
(1) Temperature drift is specified according to the box method. See Low Temperature Drift section for more details.
(2) VDO for line regulation test is 50 mV.
(3) VDO for load regulation test is 500 mV.
(4) The peak-to-peak noise measurement is explained in more detail in section Noise Performance.
(5) Long-term stability measurement procedure is explained in more detail in section Long–Term Stability.
(6) Thermal hysteresis measurement procedure is explained in more detail in section Thermal Hysteresis.