SBOS392I August   2007  – April 2026 REF33

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Thermal Hysteresis
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Start-Up Time
      2. 8.3.2 Low Temperature Drift
      3. 8.3.3 Power Dissipation
      4. 8.3.4 Noise Performance
    4. 8.4 Device Functional Modes
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 REF3312 in a Bipolar Signal-Chain Configuration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Op Amp Level-Shift Design
          2. 9.2.1.2.2 Differential Input Attenuator Design
          3. 9.2.1.2.3 Input Filtering
          4. 9.2.1.2.4 Component Selection
            1. 9.2.1.2.4.1 Voltage References
            2. 9.2.1.2.4.2 Op Amp
          5. 9.2.1.2.5 Input Attenuation and Level Shifting
          6. 9.2.1.2.6 Input Filtering
          7. 9.2.1.2.7 Passive Component Tolerances and Materials
        3. 9.2.1.3 Application Curves
          1. 9.2.1.3.1 DC Performance
          2. 9.2.1.3.2 AC Performance
    3. 9.3 Power-Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

订购信息

6.4 Thermal Information

THERMAL METRIC(1) REF33xx REF3325, REF3330 UNIT
DCK (SC70) DBZ (SOT-23) RSE (UQFN)
3 PINS 3 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 279.7 313.1 61.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 136.3 144.0 32.6 °C/W
RθJB Junction-to-board thermal resistance 56.9 109.3 16.0 °C/W
ψJT Junction-to-top characterization parameter 11.0 18.2 1.3 °C/W
ψJB Junction-to-board characterization parameter 56.1 107.9 16.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.