ZHCSNI6 march   2023 OPA928

ADVANCE INFORMATION  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4.     Thermal Information
   5. 6.4 Electrical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Guard Buffer
      2. 7.3.2 Thermal Protection
      3. 7.3.3 Capacitive Load and Stability
      4. 7.3.4 EMI Rejection
      5. 7.3.5 Common-Mode Voltage Range
   4. 7.4 Device Functional Modes
8. 8 Application and Implementation
   1. 8.1 Application Information
      1. 8.1.1 Contamination Considerations
      2. 8.1.2 Guarding Considerations
      3. 8.1.3 Humidity Considerations
      4. 8.1.4 Dielectric Relaxation
   2. 8.2 Typical Applications
      1. 8.2.1 High-Impedance (Hi-Z) Amplifier
         1. 8.2.1.1 Design Requirements
         2. 8.2.1.2 Detailed Design Procedure
         3. 8.2.1.3 Application Curve
      2. 8.2.2 Transimpedance Amplifier
         1. 8.2.2.1 Design Requirements
         2. 8.2.2.2 Detailed Design Procedure
   3. 8.3 Power-Supply Recommendations
   4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
9. 9 Device and Documentation Support
   1. 9.1 Device Support
      1. 9.1.1 Development Support
         1. 9.1.1.1 PSpice® for TI
         2. 9.1.1.2 TINA-TI™ 仿真软件（免费下载）
         3. 9.1.1.3 TI 参考设计
   2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
   3. 9.3 接收文档更新通知
   4. 9.4 支持资源
   5. 9.5 Trademarks
   6. 9.6 静电放电警告
   7. 9.7 术语表
10. 10Mechanical, Packaging, and Orderable Information