ZHCSII6C
July 2018 – January 2023
OPA855
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Thermal Information
7.4
Recommended Operating Conditions
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Input and ESD Protection
9.3.2
Feedback Pin
9.3.3
Wide Gain-Bandwidth Product
9.3.4
Slew Rate and Output Stage
9.4
Device Functional Modes
9.4.1
Split-Supply and Single-Supply Operation
9.4.2
Power-Down Mode
10
Application, Implementation, and Layout
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.3
Application Curves
10.3
Typical Application
10.3.1
Design Requirements
10.3.2
Detailed Design Procedure
10.3.3
Application Curves
10.4
Power Supply Recommendations
10.5
Layout
10.5.1
Layout Guidelines
10.5.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
支持资源
11.5
Trademarks
11.6
静电放电警告
11.7
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DSG|8
MPDS308C
散热焊盘机械数据 (封装 | 引脚)
DSG|8
QFND141I
订购信息
zhcsii6c_oa
zhcsii6c_pm
10.3.3
Application Curves
Figure 10-7
Optical Sensor TIA Frequency Response
Figure 10-9
2 Photodetector Input Characteristics TIA Frequency Response
Figure 10-8
1 Photodetector Input Characteristics TIA Frequency Response
Figure 10-10
3 Photodetector Input Characteristics TIA Frequency Response