ZHCSII6C
July 2018 – January 2023
OPA855
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Thermal Information
7.4
Recommended Operating Conditions
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Input and ESD Protection
9.3.2
Feedback Pin
9.3.3
Wide Gain-Bandwidth Product
9.3.4
Slew Rate and Output Stage
9.4
Device Functional Modes
9.4.1
Split-Supply and Single-Supply Operation
9.4.2
Power-Down Mode
10
Application, Implementation, and Layout
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.3
Application Curves
10.3
Typical Application
10.3.1
Design Requirements
10.3.2
Detailed Design Procedure
10.3.3
Application Curves
10.4
Power Supply Recommendations
10.5
Layout
10.5.1
Layout Guidelines
10.5.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
支持资源
11.5
Trademarks
11.6
静电放电警告
11.7
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DSG|8
MPDS308C
散热焊盘机械数据 (封装 | 引脚)
DSG|8
QFND141I
订购信息
zhcsii6c_oa
zhcsii6c_pm
11.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。