ZHCSK40D August   2019  – July 2020 OPA810

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: 10 V
    6. 7.6  Electrical Characteristics: 24 V
    7. 7.7  Electrical Characteristics: 5 V
    8. 7.8  Typical Characteristics: VS = 10 V
    9. 7.9  Typical Characteristics: VS = 24 V
    10. 7.10 Typical Characteristics: VS = 5 V
    11. 7.11 Typical Characteristics: ±2.375-V to ±12-V Split Supply
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 OPA810 Architecture
      2. 8.3.2 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply Operation (±2.375 V to ±13.5 V)
      2. 8.4.2 Single-Supply Operation (4.75 V to 27 V)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Amplifier Gain Configurations
      2. 9.1.2 Selection of Feedback Resistors
      3. 9.1.3 Noise Analysis and the Effect of Resistor Elements on Total Noise
    2. 9.2 Typical Applications
      1. 9.2.1 Transimpedance Amplifier
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 High-Z Input Data Acquisition Front-End
      3. 9.2.3 Multichannel Sensor Interface
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)OPA810UNIT
D (SOIC)DBV (SOT-23)DCK (SC70)
8 PINS5 PINS5 PINS
RθJAJunction-to-ambient thermal resistance134.8174.3190.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance75.294.7140.1°C/W
RθJBJunction-to-board thermal resistance78.245.469.0°C/W
ψJTJunction-to-top characterization parameter25.221.645.9°C/W
ψJBJunction-to-board characterization parameter77.445.068.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.