ZHCSJ65A December   2018  – December 2019 OPA462

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      OPA462 方框图
      2.      最大输出电压与频率间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics: Table of Graphs
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Status Flag Pin
      2. 7.3.2 Thermal Protection
      3. 7.3.3 Current Limit
      4. 7.3.4 Enable and Disable
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High DAC Gain Stage for Semiconductor Test Equipment
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Improved Howland Current Pump for Bioimpedance Measurements in Multiparameter Patient Monitors
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermally-Enhanced PowerPAD Package
      2. 10.1.2 PowerPAD Integrated Circuit Package Layout Guidelines
      3. 10.1.3 Pin Leakage
      4. 10.1.4 Thermal Protection
      5. 10.1.5 Power Dissipation
      6. 10.1.6 Heat Dissipation
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 TINA-TI™（免费软件下载）
        2. 11.1.1.2 TI 高精度设计
        3. 11.1.1.3 WEBENCH滤波器设计器
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 支持资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1.4 Thermal Protection

Figure 68 shows the thermal shutdown behavior of a socketed OPA462 that internally dissipates 1 W. Unsoldered and in a socket, the RθJA of the DDA package is typically 128°C/W. With the socket at 25°C, the output stage temperature rises to the shutdown temperature of 150°C, which triggers automatic thermal shutdown of the device. The device remains in thermal shutdown (output is in a high-impedance state) until it cools to 130°C where the device is again powered. This thermal protection hysteresis feature typically prevents the amplifier from leaving the safe operating area, even with a direct short from the output to ground or either supply. The absolute maximum specification is 180 V, and the OPA462 must not be allowed to exceed 180 V under any condition. Failure as a result of breakdown, caused by spiking currents into inductive loads (particularly with elevated supply voltage), is not prevented by the thermal protection architecture.

OPA462 ai_therm_shutdwn_bos46x_rev.pngFigure 68. Thermal Shutdown