ZHCSJ65A December   2018  – December 2019 OPA462

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      OPA462 方框图
      2.      最大输出电压与频率间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics: Table of Graphs
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Status Flag Pin
      2. 7.3.2 Thermal Protection
      3. 7.3.3 Current Limit
      4. 7.3.4 Enable and Disable
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High DAC Gain Stage for Semiconductor Test Equipment
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Improved Howland Current Pump for Bioimpedance Measurements in Multiparameter Patient Monitors
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermally-Enhanced PowerPAD Package
      2. 10.1.2 PowerPAD Integrated Circuit Package Layout Guidelines
      3. 10.1.3 Pin Leakage
      4. 10.1.4 Thermal Protection
      5. 10.1.5 Power Dissipation
      6. 10.1.6 Heat Dissipation
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 TINA-TI™（免费软件下载）
        2. 11.1.1.2 TI 高精度设计
        3. 11.1.1.3 WEBENCH滤波器设计器
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 支持资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1.1 Thermally-Enhanced PowerPAD™ Package

The OPA462 comes in an 8-pin SO PowerPAD package that provides an extremely low thermal resistance, RθJC(bot), path between the die and the exterior of the package. This package features an exposed thermal pad that has direct thermal contact with the die. Thus, excellent thermal performance is achieved by providing a good thermal path away from the thermal pad.

The OPA462 SO-8 PowerPAD is a standard-size SO-8 package constructed using a downset leadframe upon which the die is mounted, as Figure 67 shows. This arrangement results in the leadframe being exposed as a thermal pad on the underside of the package. The thermal pad on the bottom of the device can then be soldered directly to the PCB, using the PCB as a heat sink. In addition, plated-through holes (vias) provide a low thermal resistance heat flow path to the back side of the PCB. This architecture enhances the OPA462 power dissipation capability significantly, eliminates the use of bulky heat sinks and slugs traditionally used in thermal packages, and allows the OPA462 to be easily mounted using standard PCB assembly techniques.

NOTE

The SO-8 PowerPAD is pin-compatible with standard SO-8 packages, and as such, the OPA462 is a drop-in replacement for operational amplifiers in existing sockets. Always solder the PowerPAD to the PCB V– plane, even with applications that have low power dissipation. Solder the device to the PCB to provide the necessary thermal, mechanical, and electrical connections between the leadframe die pad and the PCB.
OPA462 ai_powerpad_bos391.gifFigure 67. Cross Section View of a PowerPAD™ Package