ZHCSI77F June   2009  – May 2018 OPA2354A-Q1 , OPA354A-Q1 , OPA4354-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: OPA354A-Q1
    2.     Pin Functions: OPA2354A-Q1
    3.     Pin Functions: OPA4354-Q1
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA354A-Q1
    5. 6.5 Thermal Information: OPA2354A-Q1
    6. 6.6 Thermal Information: OPA4354A-Q1
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Rail-to-Rail Output
      4. 7.3.4 Output Drive
      5. 7.3.5 Video
      6. 7.3.6 Driving Analog-to-Digital Converters
      7. 7.3.7 Capacitive Load and Stability
      8. 7.3.8 Wideband Transimpedance Amplifier
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Transimpedance Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Optimizing The Transimpedance Circuit
        3. 8.2.1.3 Application Curve
      2. 8.2.2 High-Impedance Sensor Interface
      3. 8.2.3 Driving ADCs
      4. 8.2.4 Active Filter
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 相关链接
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Thermal Information: OPA2354A-Q1

THERMAL METRIC(1) OPA2354A-Q1 UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 175.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 67.8 °C/W
RθJB Junction-to-board thermal resistance 97.1 °C/W
ψJT Junction-to-top characterization parameter 9.3 °C/W
ψJB Junction-to-board characterization parameter 95.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W