ZHCSBX8I December   2013  – May 2018 OPA172 , OPA2172 , OPA4172

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      JFET 输入低噪声放大器
      2.      出色的总谐波失真 (THD) 性能
  4. 4 修订历史记录
  5. 5 Device Comparison
    1. 5.1 Device Comparison
    2. 5.2 Device Family Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: OPA172
    2.     Pin Functions: OPA2172 and OPA4172
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA172
    5. 7.5 Thermal Information: OPA2172
    6. 7.6 Thermal Information: OPA4172
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics: Table of Graphs
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 EMI Rejection
      2. 8.3.2 Phase-Reversal Protection
      3. 8.3.3 Capacitive Load and Stability
    4. 8.4 Device Functional Modes
      1. 8.4.1 Common-Mode Voltage Range
      2. 8.4.2 Electrical Overstress
      3. 8.4.3 Overload Recovery
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Capacitive Load Drive Solution Using an Isolation Resistor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Bidirectional Current Source
      3. 9.2.3 JFET-Input Low-Noise Amplifier
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
        1. 12.1.1.1 TINA-TI（免费软件下载）
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 相关链接
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from H Revision (September 2015) to I Revision

  • Changed supply voltage values within Absolute Maximum Ratings tableGo

Changes from G Revision (June 2015) to H Revision

  • 已添加 DRG 封装至 OPA2172 器件Go
  • 已添加 WSON 至最后一个特性要点Go
  • 已添加 OPA2172 WSON 行至器件信息表Go
  • Added WSON-8 to OPA2172 row of Device Comparison table Go
  • Added DRG pinout drawing Go
  • Added DRG column to OPA2172 and OPA4172 Pin Functions table Go
  • Added DRG column to OPA2172 Thermal Information table Go

Changes from F Revision (June 2015) to G Revision

  • Added input bias current (IB) values for DGK and PW packages.Go

Changes from E Revision (December 2014) to F Revision

  • 已将器件状态从混合状态改为量产数据Go
  • 已将 OPA2172 DGK 和 OPA4172 PW 封装改为量产数据Go
  • 已添加 OPA2172 VSSOP 和 OPA4172 TSSOP 行至器件信息表Go
  • Deleted footnote from Device Comparison tableGo
  • Deleted footnote from OPA2172 DGK and OPA4172 PW pin out drawings Go
  • Added OPA2172 DGK thermal information Go

Changes from D Revision (September 2014) to E Revision

  • 已将 OPA2172 D 封装从产品预览改为量产数据Go
  • 已更改器件信息表Go
  • Changed Device Comparison table note (1) to show preview packagesGo
  • Changed Handling Ratings table to ESD Ratings tableGo

Changes from C Revision (July 2014) to D Revision

  • 已更改低噪声 特性 要点值，从 6nV/√Hz 改为 7Go
  • 已将 特性 要点中的 MSOP 改为 VSSOPGo
  • 已添加封装和新的注释 2 至器件信息表Go
  • Changed OPAx172 voltage noise density from 6 nV/√Hz to 7 in Device Family Comparison table Go
  • Changed OPA4172 package from DGK to PW in Pin Functions tableGo
  • Added OPA2172 Thermal Information tableGo
  • Changed input voltage noise value in Electrical Characteristics from 1.2 µVPP to 2.5 µVPPGo
  • Changed input voltage noise density value at 100 Hz in Electrical Characteristics from 8.6 nV/√Hz to 12Go
  • Changed input voltage noise density value at 1 kHz in Electrical Characteristics from 6 nV/√Hz to 7Go
  • Changed voltage output swing values in the Electrical CharacteristicsGo
  • Changed Figure 13Go
  • Changed Figure 14Go
  • Added new note to Applications and Implementation section Go

Changes from B Revision (May 2014) to C Revision

  • 已将 OPA4172 D 封装 (SOIC-14) 从产品预览改为量产数据Go
  • Added OPA4172-D Thermal information Go
  • Added Channel separation parameter to the Electrical CharacteristicsGo
  • Added Channel Separation vs Frequency plot Go

Changes from A Revision (April 2014) to B Revision

  • 已将 DCK (SC70) 封装从产品预览改为量产数据Go

Changes from * Revision (December 2013) to A Revision