ZHCSBX8I December   2013  – May 2018 OPA172 , OPA2172 , OPA4172

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      JFET 输入低噪声放大器
      2.      出色的总谐波失真 (THD) 性能
  4. 修订历史记录
  5. Device Comparison
    1. 5.1 Device Comparison
    2. 5.2 Device Family Comparison
  6. Pin Configuration and Functions
    1.     Pin Functions: OPA172
    2.     Pin Functions: OPA2172 and OPA4172
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA172
    5. 7.5 Thermal Information: OPA2172
    6. 7.6 Thermal Information: OPA4172
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics: Table of Graphs
    9. 7.9 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 EMI Rejection
      2. 8.3.2 Phase-Reversal Protection
      3. 8.3.3 Capacitive Load and Stability
    4. 8.4 Device Functional Modes
      1. 8.4.1 Common-Mode Voltage Range
      2. 8.4.2 Electrical Overstress
      3. 8.4.3 Overload Recovery
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Capacitive Load Drive Solution Using an Isolation Resistor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Bidirectional Current Source
      3. 9.2.3 JFET-Input Low-Noise Amplifier
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
        1. 12.1.1.1 TINA-TI(免费软件下载)
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 相关链接
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information: OPA172

THERMAL METRIC(1) OPA172 UNIT
D (SOIC) DBV (SOT-23) DCK (SC70)
8 PINS 5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 126.5 227.9 285.2 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 80.6 115.7 60.5 °C/W
RθJB Junction-to-board thermal resistance 67.1 65.9 78.9 °C/W
ψJT Junction-to-top characterization parameter 31.0 10.7 0.8 °C/W
ψJB Junction-to-board characterization parameter 66.6 65.3 77.9 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A N/A °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC package Thermal Metrics application report.