ZHCSR58E April   2005  – October 2022 MAX3243E

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. 说明(续)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings - IEC Specifications
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Driver Electrical Characteristics
    8. 7.8  Receiver, Electrical Characteristics
    9. 7.9  Auto-Powerdown Electrical Characteristics
    10. 7.10 Driver Switching Characteristics
    11. 7.11 Receiver Switching Characteristics
    12. 7.12 Auto-Powerdown Switching Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 ESD Protection
          1. 10.2.2.1.1 ESD Test Conditions
          2. 10.2.2.1.2 Human Body Model (HBM)
          3. 10.2.2.1.3 IEC61000-4-2 (Formerly Known as IEC1000-4-2)
          4. 10.2.2.1.4 Machine Model
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Example
        1.       Device and Documentation Support
          1. 11.1 Receiving Notification of Documentation Updates
          2. 11.2 支持资源
          3. 11.3 Trademarks
          4. 11.4 Electrostatic Discharge Caution
          5. 11.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息
IEC61000-4-2 (Formerly Known as IEC1000-4-2)

Unlike the HBM, MM, and CDM, ESD tests that apply to component level integrated circuits, the IEC61000-4-2 is a system-level ESD testing and performance standard that pertains to the end equipment. The MAX3243E device is designed to enable the manufacturer in meeting the highest level (Level 4) of IEC61000-4-2 ESD protection with no further need of external ESD protection circuitry. The more stringent IEC test standard has a higher peak current than the HBM, due to the lower series resistance in the IEC model.

Figure 10-4 shows the IEC61000-4-2 model, and Figure 10-5 shows the current waveform for the corresponding ±8-kV Contact-Discharge (Level 4) test. This waveform is applied to a probe that has been connected to the DUT. On the other hand, the corresponding ±15-kV (Level 4) Air-Gap Discharge test involves approaching the DUT with an already energized probe.

GUID-19D8D6F9-5DBE-4BF0-9C7D-D19AB105FC26-low.gifFigure 10-4 Simplified IEC61000-4-2 ESD Test Circuit
GUID-1E4757B6-8717-409D-9C92-056B49DE3BAE-low.gif Figure 10-5 Typical Current Waveform of IEC61000-4-2 ESD Generator