ZHCSU09I July   2004  – February 2025 LP2981 , LP2981A

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
        1. 6.3.3.1 Current Limit (Legacy Chip)
        2. 6.3.3.2 Current Limit (New Chip)
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
      6. 6.3.6 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors (Legacy Chip)
          1. 7.1.1.1.1 Tantalum Capacitors
          2. 7.1.1.1.2 Ceramic Capacitors
          3. 7.1.1.1.3 Aluminum Capacitors
        2. 7.1.1.2 Recommended Capacitors (New Chip)
      2. 7.1.2 Input and Output Capacitor Requirements
        1. 7.1.2.1 Input Capacitor
        2. 7.1.2.2 Output Capacitor
          1. 7.1.2.2.1 Output Capacitor (Legacy Chip)
          2. 7.1.2.2.2 Output Capacitor (New Chip)
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON and OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

at TA = 25°C, VIN = VO(NOM) + 1V, COUT = 10µF, CIN = 1µF all voltage options, ON/OFF pin tied to VIN (unless otherwise noted)

LP2981 LP2981A Output Voltage
            vs Load Current (Legacy Chip)
VIN = 4.3V, VOUT = 3.3V
Figure 5-1 Output Voltage vs Load Current (Legacy Chip)
LP2981 LP2981A Load Regulation
            vs Temperature (New Chip)
VIN = 4.3V, VOUT = 3.3V
Figure 5-3 Load Regulation vs Temperature (New Chip)
LP2981 LP2981A Output Voltage
            vs VIN (New Chip)
VOUT = 3.3V
Figure 5-5 Output Voltage vs VIN (New Chip)
LP2981 LP2981A Line Regulation
            vs VIN and Temperature (New Chip)
VOUT = 3.3V, IL = 1mA
Figure 5-7 Line Regulation vs VIN and Temperature (New Chip)
LP2981 LP2981A Dropout Voltage
              (VDO) vs Load Current (New Chip)
 
Figure 5-9 Dropout Voltage (VDO) vs Load Current (New Chip)
LP2981 LP2981A Ground Pin
            Current (IGND) vs Load Current (New Chip)
 
Figure 5-11 Ground Pin Current (IGND) vs Load Current (New Chip)
LP2981 LP2981A Line Transient
            Response (New Chip)
VOUT = 3.3V, IL = 100mA
Figure 5-13 Line Transient Response (New Chip)
LP2981 LP2981A Load Transient
            Response (New Chip)
VOUT = 3.3V, COUT = 2.2μF
Figure 5-15 Load Transient Response (New Chip)
LP2981 LP2981A Short-Circuit
            Current vs Time (New Chip)
VIN = 16.0V
Figure 5-17 Short-Circuit Current vs Time (New Chip)
LP2981 LP2981A Short-Circuit
            Current vs Output Voltage (VOUT) (New Chip)
 
Figure 5-19 Short-Circuit Current vs Output Voltage (VOUT) (New Chip)
LP2981 LP2981A Ripple
            Rejection vs Output Capacitor (CL) and Frequency (New Chip)
 
Figure 5-21 Ripple Rejection vs Output Capacitor (CL) and Frequency (New Chip)
LP2981 LP2981A Output Noise
            Density vs Output Capacitor (CL) Frequency (New Chip)
 
Figure 5-23 Output Noise Density vs Output Capacitor (CL) Frequency (New Chip)
LP2981 LP2981A Turn-On
            Waveform (New Chip)
VOUT = 3.3V, RL = 3.3kΩ
Figure 5-25 Turn-On Waveform (New Chip)
LP2981 LP2981A ON/OFF Pin Current vs VON/OFF
            (New Chip)
VIN = 4.3V
Figure 5-27 ON/OFF Pin Current vs VON/OFF (New Chip)
LP2981 LP2981A ON/OFF Threshold vs Temperature (New Chip)
 
Figure 5-29 ON/OFF Threshold vs Temperature (New Chip)
LP2981 LP2981A Output Voltage
            vs Load Current (New Chip)
VIN = 4.3V, VOUT = 3.3V
Figure 5-2 Output Voltage vs Load Current (New Chip)
LP2981 LP2981A Output Voltage
            vs Temperature (New Chip)
VIN = 4.3V, VOUT = 3.3V
Figure 5-4 Output Voltage vs Temperature (New Chip)
LP2981 LP2981A Output Voltage
            vs VIN and Temperature (New Chip)
VOUT = 3.3V, IL = 1mA
Figure 5-6 Output Voltage vs VIN and Temperature (New Chip)
LP2981 LP2981A Dropout Voltage
              (VDO) vs Temperature (New Chip)
 
Figure 5-8 Dropout Voltage (VDO) vs Temperature (New Chip)
LP2981 LP2981A Ground Pin
            Current (IGND) vs Temperature (New Chip)
 
Figure 5-10 Ground Pin Current (IGND) vs Temperature (New Chip)
LP2981 LP2981A Input Current
            vs Input Voltage (VIN) (New Chip)
VOUT = 3.3V, RL = 3.3kΩ
Figure 5-12 Input Current vs Input Voltage (VIN) (New Chip)
LP2981 LP2981A Line Transient
            Response (New Chip)
VOUT = 3.3V, IL = 1mA
Figure 5-14 Line Transient Response (New Chip)
LP2981 LP2981A Short-Circuit
            Current vs Time (New Chip)
VIN = 6.0V
Figure 5-16 Short-Circuit Current vs Time (New Chip)
LP2981 LP2981A Instantaneous
            Short-Circuit Current vs Temperature (New Chip)
 
Figure 5-18 Instantaneous Short-Circuit Current vs Temperature (New Chip)
LP2981 LP2981A Ripple
            Rejection vs Load Current (IL) and Frequency (New Chip)
 
Figure 5-20 Ripple Rejection vs Load Current (IL) and Frequency (New Chip)
LP2981 LP2981A Output Noise
            Density vs Load Current (IL) Frequency (New Chip)
 
Figure 5-22 Output Noise Density vs Load Current (IL) Frequency (New Chip)
LP2981 LP2981A Output Reverse
            Leakage vs Temperature (New Chip)
 
Figure 5-24 Output Reverse Leakage vs Temperature (New Chip)
LP2981 LP2981A Turn-Off
            Waveform (New Chip)
VOUT = 5V, RL = 5kΩ
Figure 5-26 Turn-Off Waveform (New Chip)
LP2981 LP2981A ON/OFF Pin Current vs VON/OFF
            (New Chip)
VIN = 16.0V
Figure 5-28 ON/OFF Pin Current vs VON/OFF (New Chip)