ZHCSU09I July   2004  – February 2025 LP2981 , LP2981A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
        1. 6.3.3.1 Current Limit (Legacy Chip)
        2. 6.3.3.2 Current Limit (New Chip)
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
      6. 6.3.6 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors (Legacy Chip)
          1. 7.1.1.1.1 Tantalum Capacitors
          2. 7.1.1.1.2 Ceramic Capacitors
          3. 7.1.1.1.3 Aluminum Capacitors
        2. 7.1.1.2 Recommended Capacitors (New Chip)
      2. 7.1.2 Input and Output Capacitor Requirements
        1. 7.1.2.1 Input Capacitor
        2. 7.1.2.2 Output Capacitor
          1. 7.1.2.2.1 Output Capacitor (Legacy Chip)
          2. 7.1.2.2.2 Output Capacitor (New Chip)
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON and OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision H (May 2024) to Revision I (February 2025)

  • 通篇添加了 LP2981A 信息Go
  • 向说明部分的最后一句添加了澄清文字，说明了软启动机制涉及的是新芯片Go
  • Changed description of NC (pin 4)Go
  • Changed Short-Circuit Current vs Time (New Chip), Instantaneous Short-Circuit Current vs Temperature (New Chip), Short-Circuit Current vs Output Voltage (VOUT) (New Chip) curvesGo
  • Changed Overview sectionGo
  • Changed Functional Block Diagrams sectionGo
  • Changed Output Enable sectionGo
  • Added Current Limit (Legacy Chip) and Current Limit (New Chip) sectionsGo
  • Added maximum supported ESR range discussion to Recommended Capacitors (New Chip) sectionGo
  • Changed Output Capacitor sectionGo
  • Changed Device Nomenclature sectionGo

Changes from Revision G (July 2016) to Revision H (December 2023)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 更改了整个文档以与当前系列格式保持一致Go
  • 向文档添加了 M3 器件Go
  • Added Device Nomenclature sectionGo
  • Added three references to Related Documentation Go